4

INA233

SBOS790 – APRIL 2017

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Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

IN+ and IN– can have a differential voltage between –40 V and 40 V. However, the voltage at these pins must not exceed the range of

–0.3 V to 40 V.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

6

V

Analog Inputs, IN+, IN–

(2)

–40

40

V

Common-mode

–0.3

40

VBUS pin voltage

–0.3

40

V

SDA, SCL pin voltages

GND – 0.3

6

V

A0, A1 pin voltages

GND – 0.3

6

V

Input current into any pin

5

mA

Open-drain digital output current

10

mA

Junction temperature

150

°C

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2500

V

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Common-mode input voltage

0

36

V

Operating supply voltage

2.7

5.5

V

Operating free-air temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

INA233

UNIT

DGS (VSSOP)

10 PINS

Junction-to-ambient thermal resistance

171.4

°C/W

Junction-to-case (top) thermal resistance

42.9

°C/W

Junction-to-board thermal resistance

91.8

°C/W

Junction-to-top characterization parameter

1.5

°C/W

Junction-to-board characterization parameter

90.2

°C/W

Junction-to-case (bottom) thermal resistance

n/a

°C/W