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STTH30L06-Y Datasheet(PDF) 4 Page - STMicroelectronics

Part # STTH30L06-Y
Description  Low thermal resistance
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STTH30L06-Y Datasheet(HTML) 4 Page - STMicroelectronics

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Characteristics
STTH30L06-Y
4/8
Doc ID 018925 Rev 1
Figure 7.
Reverse recovery softness factor
versus dIF/dt (typical values)
Figure 8.
Relative variations of dynamic
parameters versus junction
temperature
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0
50
100
150
200
250
300
350
400
450
500
S factor
I < 2 x I
T =125°C
F
F(AV)
j
V =400V
R
dI /dt(A/µs)
F
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
25
50
75
100
125
IRM
QRR
trr
S factor
T (°C)
j
I=I
Reference: T =125°C
F
F(AV)
j
V =400V
R
Figure 9.
Transient peak forward voltage
versus dIF/dt (typical values)
Figure 10.
Forward recovery time versus dIF/dt
(typical values)
0
1
2
3
4
5
6
7
8
9
10
0
50
100
150
200
250
300
350
400
450
500
V
(V)
FP
dI /dt(A/µs)
F
I=I
T =125°C
F
F(AV)
j
0
50
100
150
200
250
300
350
400
450
500
0
100
200
300
400
500
t (ns)
fr
dI /dt(A/µs)
F
D PAK
2
I=I
T =125°C
F
F(AV)
j
V
=1.1 x V max.
FR
F
Figure 11.
Junction capacitance versus
reverse voltage applied
(typical values)
Figure 12.
Thermal resistance junction to
ambient versus copper surface
under tab
10
100
1000
1
10
100
1000
C(pF)
V (V)
R
F=1MHz
V
=30mV
T =25°C
OSC
RMS
j
R
(°C/W)
th(j-a)
0
10
20
30
40
50
60
70
80
0
5
10
15
20
25
30
35
40
S
(cm²)
CU
Epoxy printed circuit board
FR4, copper thickness = 35 µm


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