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TPS22810

SLVSDH0B – DECEMBER 2016 – REVISED MAY 2017

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Copyright © 2016–2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Input voltage

–0.3

20

V

Output voltage

–0.3

min(VIN + 0.3, 20)

V

EN/UVLO voltage

–0.3

20

V

Maximum junction temperature

150

°C

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

±2000

V

±1000

(1)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

(2)

See the Detailed Description section.

7.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input voltage

2.7

18

V

EN/UVLO voltage

0

18

V

Output voltage

V

IMAX

2

A

3

–40

105

°C

Input capacitor

µF

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

TPS22810

UNIT

DBV (SOT23)

DRV (WSON)

6 PINS

6 PINS

Junction-to-ambient thermal resistance

182

74.6

°C/W

Junction-to-case (top) thermal resistance

127.2

80.3

°C/W

Junction-to-board thermal resistance

16.9

44.3

°C/W

Junction-to-top characterization parameter

26.4

3.2

°C/W

Junction-to-board characterization parameter

36.3

44.6

°C/W