10

AT17N256/512/010/002/040

3020A–CNFG–04/10/03

Notes:

1. For more information refer to the “Thermal Characteristics of Atmel’s Packages”, available on the Atmel web site.

2. Airflow = 0 ft/min.

Thermal Resistance Coefficients(1)

Package Type

AT17N256

AT17N512/

AT17N010

AT17N002

AT17N040

8CN4

Leadless Array Package (LAP)

θ

–

45

45

–

θ

JA

[

°C/W](2)

–

135.71

159.60

–

8P3

Plastic Dual Inline Package

(PDIP)

θ

37

37

–

–

θ

JA

[

°C/W](2)

107

107

–

–

8S1

Plastic Gull Wing Small Outline

(SOIC)

θ

45

–

–

–

θ

JA

[

°C/W](2)

150

–

–

–

20S2

Plastic Gull Wing Small Outline

(SOIC)

θ

–

θ

JA

[

°C/W](2)

–

44A

Thin Plastic Quad Flat

Package (TQFP)

θ

–

–

17

17

θ

JA

[

°C/W](2)

––

62

62