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ML9058E Datasheet(PDF) 64 Page - LAPIS Semiconductor Co., Ltd. |
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ML9058E Datasheet(HTML) 64 Page - LAPIS Semiconductor Co., Ltd. |
64 / 76 page FEDL9058E-01 LAPIS Semiconductor ML9058E 64/76 ML9058E ALIGNMENT MARK SPECIFICATION 1 Alignment Mark Coordinates Alignment mark X(µm) Y(µm) A –4270.3 1364.5 B 4259.7 1364.5 C 4455 –1180.9 D –4455 –1180.9 E –4458.5 1368 F 4458.5 –1368 Alignment Mark Construction Layer A,B,C,D: Metal Layer E,F:Bump Layer Alignment Mark Specification Symbol Parameter Mark Size(µm) A,B,C,D 34 a Alignment mark Width E,F 43 A,B,C,D 100 b Alignment mark Size E,F 98 A,B,C 60 Alignment mark-to-adjacent pad metal Distance (MIN.) D 106.6 E 109.4 c Alignment mark-to-adjacent pad bump Distance (MIN.) F 77 a b a b Bump Bump c c a b a b Metal c c Metal Coordinate point Coordinate point (0 A B C D X Y (0,0) E F |
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