ML9058E datasheet(65/76 Pages) LAPIS

Part #	ML9058E

Description	132-Channel LCD Driver

Download	76 Pages

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Manufacturer	LAPIS [LAPIS Semiconductor Co., Ltd.]

Direct Link	http://www.lapis-semi.com/

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65 / 76 page

FEDL9058E-01

LAPIS Semiconductor

ML9058E

65/76

ML9058E GOLD BUMP SPECIFICATION

Gold Bump Specification

Symbo

l

Parameter

Min.

Typ.

Max.

Unit

A

Bump Pitch (Min.Section: Segment Section)

52

—

m

B

Bump Size (Segment Section: Pitch Direction)

29

32

35

m

C

Bump Size (Segment Section: Depth Direction)

114

117

120

m

D

Bumo-to-Bump Distance

(Segment Section: Pitch Direction)

17

20

23

m

E

Bump Pitch (Min.Section: Input Section)

85

—

m

F

Bump Size (Input Section: Pitch Direction)

57

60

63

m

G

Bump Size (Input Section: Depth Direction)

67

70

73

m

H

Bumo-to-Bump Distance

(Input Section: Pitch Direction)

22

25

28

m

I

Bump Size (Figure “L” alignment mark: Length)

95

98

101

m

J

Bump Size (Figure “L” alignment mark: Width)

40

43

46

m

—

Pad center to Bump center allowable error

—

2

m

K

Bump Height

12

15

18

m

—

Bumph Height Dispersion Inside Chip (Range)

—

3

m

L

Bump Edge Height

—

3

m

—

Shear Strength (g)

18

—

g

—

Bump hardness: High (Hv: 25g load)

50

—

110

Hv

—

Bump hardness: Low (Hv: 25g load)

30

—

70

Hv

 Chip Thickness: 625 15 m

 Chip Size: 9.164mm  2.982mm

Top View and Cross Section View

A

B

D

E

H

F

Segment

Section

Cross Section View

Figure “L”

Alignment Mark

Input Section

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