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F862BC104M310Z Datasheet(PDF) 8 Page - Kemet Corporation |
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F862BC104M310Z Datasheet(HTML) 8 Page - Kemet Corporation |
8 / 14 page ![]() © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com F3092_F862_X2_310 • 9/23/2016 8 Film Capacitors – AC Line EMI Suppression and RC Networks F862 Series Metallized Polypropylene Film for Harsh Environmental Conditions, Class X2, 310 VAC (Automotive Grade) Manual Soldering Recommendations Following is the recommendation for manual soldering with a soldering iron. The soldering iron tip temperature should besetat350°C(+10°Cmaximum)withthe soldering duration not to exceed more than 3 seconds. Recommended Soldering Temperature 0 50 100 150 200 250 300 350 400 0 1 2 3 4 5 6 7 8 Soldering time (sec) Soldering Process The implementation of the RoHS directive has resulted in the selection of SnAgCu (SAC) alloys or SnCu alloys as primary solder. Thishasincreasedtheliquidustemperaturefromthatof183ºCforSnPbeutecticalloyto217–221ºCforthenewalloys.Asa result,theheatstresstothecomponents,eveninwavesoldering,hasincreasedconsiderablyduetohigherpre-heatandwave temperatures.Polypropylenecapacitorsareespeciallysensitivetoheat(themeltingpointofpolypropyleneis160–170ºC).Wave solderingcanbedestructive,especiallyformechanicallysmallpolypropylenecapacitors(withleadspacingof5mmto15mm), andgreatcarehastobetakenduringsoldering.TherecommendedsolderprofilesfromKEMETshouldbeused.Pleaseconsult KEMETwithanyquestions.Ingeneral,thewavesolderingcurvefromIECPublication61760-1Edition2servesasasolidguideline for successful soldering. Please see Figure 1. Reflowsolderingisnotrecommendedforthrough-holefilmcapacitors.Exposingcapacitorstoasolderingprofileinexcessofthe abovetherecommendedlimitsmayresulttodegradationorpermanentdamagetothecapacitors. Do not place the polypropylene capacitor through an adhesive curing oven to cure resin for surface mount components. Insert through-holepartsafterthecuringofsurfacemountparts.ConsultKEMETtodiscusstheactualtemperatureprofileintheoven, if through-hole components must pass through the adhesive curing process. A maximum two soldering cycles is recommended. Pleaseallowtimeforthecapacitorsurfacetemperaturetoreturntoanormaltemperaturebeforethesecondsolderingcycle. Wave Soldering Recommendations 0 50 100 150 200 250 300 0 40 80 120 160 200 240 Time (s) ca 2°C/s ca 3.5°C/s typical ca 5°C/s Cooling 2+3s max 115°C max Tpreheat ΔT <150°C 100°C Preheating Typical First wave Second wave 260°C |
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