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HSDL-3209-021 Datasheet(PDF) 2 Page - Lite-On Technology Corporation |
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HSDL-3209-021 Datasheet(HTML) 2 Page - Lite-On Technology Corporation |
2 / 16 page Notes: 1. CX1, CX2, CX3 and CX4 must be placed within 0.7 cm of the HSDL-3209 to obtain optimum noise immunity. Recommended Application Circuit Components I/O Pins Configuration Table Order Information Part Number Packaging Type Package Quantity HSDL-3209-021 Tape and Reel Front View 2500 Pin Symbol Description I/O Type Function 1 LED A LED Anode Input Tied through external resistor, R1, to VLED from 2.4V to 4.5V. Please refer to Table 1 for VLED versus Series Resistor, R1. 2 RXD Receive Data Output, Active Low This pin is capable of driving a standard CMOS or TTL load. No external pull-up or pull down resistor is required. It is in tri-state mode when the transceiver is in shutdown mode. 3 TXD Transmit Data Input, Active High This pin is used to transmit serial data when SD pin is low. If held high longer than ~ 50ms, the LED will be turned off. 4 SD Shutdown Input, Active High The transceiver is in shutdown mode if this pin is high 5 IOVcc Input/Output ASIC Vcc Input/Output Active High Connect to ASIC logic controller Vcc Voltage as low as 1.5V. 6 Vcc Supply Voltage Supply Voltage Regulated, 2.4 to 3.6 Volts. 7 GND Ground Ground Connect to system ground. Component Recommended Value Note R1 15W±5%, 0.0625 Watt for 2.4 ≤ Vled ≤ 2.7V 27W±5%, 0.0625 Watt for 2.7 < Vled ≤ 3.6V 36W±5%, 0.0625 Watt for 3.6 < Vled ≤ 4.5V CX1, CX4 0.47 µF ± 20%, X7R Ceramic 1 CX2, CX3 6.8 µF ± 20%, X7R Ceramic or Tantalum 1 CAUTIONS: The CMOS inherent to the design of this component increases the component’s susceptibility to damage from the electrostatic discharge (ESD). It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD |
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