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HSDL-3209-021 Datasheet(PDF) 2 Page - Lite-On Technology Corporation

Part # HSDL-3209-021
Description  IrDA Data Compliant Low Power 115.2 kbit/s Infrared Transceiver
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Manufacturer  LITEON [Lite-On Technology Corporation]
Direct Link  http://www.liteon.com.tw/databook/default.htm
Logo LITEON - Lite-On Technology Corporation

HSDL-3209-021 Datasheet(HTML) 2 Page - Lite-On Technology Corporation

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Notes:
1. CX1, CX2, CX3 and CX4 must be placed within 0.7 cm of the HSDL-3209 to obtain optimum noise immunity.
Recommended Application Circuit Components
I/O Pins Configuration Table
Order Information
Part Number
Packaging Type
Package
Quantity
HSDL-3209-021
Tape and Reel
Front View
2500
Pin
Symbol
Description
I/O Type
Function
1
LED A
LED Anode
Input
Tied through external resistor, R1, to VLED from 2.4V to
4.5V. Please refer to Table 1 for VLED versus Series Resistor,
R1.
2
RXD
Receive Data
Output,
Active Low
This pin is capable of driving a standard CMOS or TTL load.
No external pull-up or pull down resistor is required. It is in
tri-state mode when the transceiver is in shutdown mode.
3
TXD
Transmit Data
Input,
Active High
This pin is used to transmit serial data when SD pin is low.
If held high longer than ~ 50ms, the LED will be turned off.
4
SD
Shutdown
Input,
Active High
The transceiver is in shutdown mode if this pin is high
5
IOVcc
Input/Output
ASIC Vcc
Input/Output
Active High
Connect to ASIC logic controller Vcc Voltage as low as 1.5V.
6
Vcc
Supply
Voltage
Supply
Voltage
Regulated, 2.4 to 3.6 Volts.
7
GND
Ground
Ground
Connect to system ground.
Component
Recommended Value
Note
R1
15W±5%, 0.0625 Watt for 2.4
Vled 2.7V
27W±5%, 0.0625 Watt for 2.7 < Vled
3.6V
36W±5%, 0.0625 Watt for 3.6 < Vled
4.5V
CX1, CX4
0.47
µF ± 20%, X7R Ceramic
1
CX2, CX3
6.8
µF ± 20%, X7R Ceramic or Tantalum
1
CAUTIONS: The CMOS inherent to the design of this component increases the component’s susceptibility to damage
from the electrostatic discharge (ESD). It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD


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