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HSDL-3209-021 Datasheet(PDF) 8 Page - Lite-On Technology Corporation |
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HSDL-3209-021 Datasheet(HTML) 8 Page - Lite-On Technology Corporation |
8 / 16 page Moisture Proof Packaging All HSDL-3209 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 3. Units in A Sealed Mositure-Proof Package Package Is Opened (Unsealed) Environment less than 30 deg C, and less than 60% RH ? Package Is Opened less than 168 hours ? Perform Recommended Baking Conditions No Baking Is Necessary No Yes No Yes Baking Conditions: If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Baking should only be done once. Recommended Storage Conditions: Before MBB Unsealed PACKAGE Temperature Time In Reel 60°C ≥ 48 hours In Bulk 100°C ≥ 4 hours Storage temperatureStorage temperature Storage Temperature 10°C to 30°C Relative Humidity below 60% RH Time from unsealing to soldering: After removal from the bag, the parts should be soldered within 168 hours if stored at the recommended storage conditions. |
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Similar Description - HSDL-3209-021 |
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