2

Recommended Application Circuit Components

Component

Recommended Value

Note

R1

47

Ω, ± 1%, 0.125 Watt

C1

6.8

µF, ± 20%, Tantalum

4

C2

100 nF,

± 20%, X7R Ceramic

Note:

4. C1 must be placed within 0.7 cm of the HSDL-3200 to obtain optimum noise immunity.

I/O Pins Configuration Table

Pin

Description

Symbol

Active

Note

1

Ground

GND

2

Pin Bypass Capacitor

CX

3

Supply Voltage

4

Analog Ground

AGND

5

Shut Down

SD

High

1

6

Receiver Data Output

RXD

Low

7

Transmitter Data Input

TXD

High

8

LED Anode

LEDA

Note:

1. The shutdown pin (SD) must be driven either high or low. Do NOT float the pin.

Caution: The BiCMOS inherent to this design of this component increases the component’s

susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static

precautions be taken in handling and assembly of this component to prevent damage and/or

degradation which may be induced by ESD.

Ordering Information

The ordering information is as shown

in the table below. There are two

options available.

Front Option

#021

Taped and 13” Reel

packaging, 2500 per reel

Top Option

–028

Taped and 13” Reel

Packaging, 2500 per reel

Transceiver I/O Truth Table

Inputs

Outputs

TXD

Light Input to Receiver

SD

LED

RXD

Notes

High

Don’t Care

Low

On

Not Valid

Low

High

Low

Off

Low

2, 3

Low

Low

Low

Off

High

Don’t Care

Don’t Care

High

Off

High

Notes:

2. In-Band IrDA signals and data rates

≤115.2 Kb/s.

3. RXD Logic Low is a pulsed response. The condition is maintained for a duration dependent on pattern and strength of the incident intensity.