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43

SPM2007 (4/08)

SMT POWER INDUCTORS

Shielded Drum Core Series

Notes from Tables (pages 27 - 42)

1. Unless otherwise specified, all testing is made at

100kHz, 0.1VAC.

2. Optional Tape & Reel packaging can be ordered by

adding a "T" suffix to the part number (i.e. P1166.102NL

becomes P1166.102NLT). Pulse complies with industry

standard Tape and Tape & Reel specification EIA481.

3. The "NL" suffix indicates an RoHS-compliant part

number. Non-NL suffixed parts are not necessarily

RoHS compliant, but are electrically and mechanically

equivalent to NL versions. If a part number does not

have the "NL" suffix, but an RoHS compliant version is

required, please contact Pulse for availability.

4. Temperature of the component (ambient plus

temperature rise) must be within specified operating

temperature range.

5. The rated current (Irated) as listed is either the satura-

tion current or the heating current depending on which

value is lower.

6. The saturation current, Isat, is the current at which

the component inductance drops by the indicated

percentage (typical) at an ambient temperature of

25°C. This current is determined by placing the

component in the specified ambient environment and

applying a short duration pulse current (to eliminate

self-heating effects) to the component.

7. The heating current, Idc, is the DC current required

to raise the component temperature by the indicated

delta (approximately). The heating current is

determined by mounting the component on a

typical PCB and applying current for 30 minutes. The

temperature is measured by placing the thermocouple

on top of the unit under test.

8. In high volt*time (Et) or ripple current applications, addi-

tional heating in the component can occur due to core

losses in the inductor which may necessitate derating

the current in order to limit the temperature rise of the

component. In order to determine the approximate total

loss (or temperature rise) for a given application, both

copper losses and core losses should be taken into

account.

Estimated Temperature Rise:

Total loss = Copper loss + Core loss (mW)

Bac (peak to peak flux density) = K2 x

ΔI (Ga)

[= K2/L(µH) x Et(V-µSec) (Ga)]

where f varies between 25kHz and 1MHz, and Bac is

less than 2500 Gauss.

K2 is a core size and winding dependant value and

is given for each p/n in the proceeding datasheets.

K0 & K1 are platform and material dependant constants

and are given in the table below for each platform.

PG0085

2.3

5.29E-10

PG0087

5.8

15.2E-10

PG0040/41

0.8

2.80E-10

P1174

0.8

6.47E-10

PF0601

4.6

14.0E-10

PF0464

3.6

24.7E-10

PF0465

3.6

33.4E-10

P1166

1.9

29.6E-10

P1167

2.1

42.2E-10

PF0560NL

5.5

136E-10

P1168/69

4.8

184E-10

P1170/71

4.3

201E-10

P1172/73

5.6

411E-10

PF0552NL

8.3

201E-10

PF0553NL

7.1

411E-10

Part No.

Trise Factor

Core Loss Factor

(K0 )

(K1)

Take note that the component's temperature rise varies depending on the system condition. It is suggested that the

component be tested at the system level, to verify the temperature rise of the component during system operation.

CoreLoss/K1 Vs Flux Density

0

0.50E+10

1.00E+10

1.50E+10

2.00E+10

2.50E+10

3.00E+10

0

500

1000

1500

2000

2500

DB (Gauss)

where DB = K2 x DI [= K2/L(µH) x Et(V-µSec)]

100KHz

200KHz

300KHz

400KHz

500KHz

700KHz

1.0MHz