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HMC173MS8 Datasheet(PDF) 6 Page - Hittite Microwave Corporation |
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HMC173MS8 Datasheet(HTML) 6 Page - Hittite Microwave Corporation |
6 / 6 page 2 - 31 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Web Site: www.hittite.com MICROWAVE CORPORATION FEBRUARY 2001 2 HMC173MS8 VOLTAGE VARIABLE ATTENUATOR 800-2000 MHz The circuit board used in the final application should use RF circuit design techniques. Signal lines should have 50 ohm impedance while the package ground leads should be connected directly to the ground plane similar to that shown below. A sufficient number of VIA holes should be used to connect the top and bottom ground planes. The evaluation circuit board as shown is available from Hittite upon request. Evaluation Circuit Board Evaluation Circuit Board Layout Design Details Layout Technique Grounded Co-Planar Waveguide (GCPW) Material FR4 Dielectric Thickness 0.028" (0.71 mm) 50 Ohm Line Width 0.037" (0.94 mm) Gap to Ground Edge 0.010" (0.25 mm) Ground VIA Hole Diameter 0.014" (0.36 mm) Connectors SMA-F ( EF - Johnson P/N 142-0701-806) HMC173MS8 |
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