TM

Innovative Technology

for a Connected World

Thermoelectric Module

Americas: +1 888.246.9050

Europe: +46.31.704.67.57

Asia: +86.755.2714.1166

clv.customerpos@lairdtech.com

www.lairdtech.com

SUFFIX THICKNESS

(PRIOR TO TINNING)

FLATNESS &

PARALLELISM

HOT FACE COLD FACE LEAD LENGTH

11

0.106” +/- 0.002”

0.002” / 0.002”

Lapped

Lapped

2.0”

TB

0.106” +/- 0.0005”

0.0005” / 0.0005” Lapped

Lapped

2.0”

00

0.118” +/- 0.005”

NA / NA

Metallized

Metallized

2.0”

22

0.118” +/- 0.005”

NA / NA

Pre-tinned

Pre-tinned

2.0”

GG

0.118” +/- 0.005”

NA / NA

Au Plated

Au Plated

2.0”

FEATURES

• Miniaturegeometricsizes

• Precisetemperaturecontrol

• Reliablesolidstateoperation

• Nosoundorvibration

• DCoperation

• RoHScompliant

APPLICATIONS

•Laserdiodes

•CCDcameras

•Infrared(IR)sensors

•Pumplasers

•Crystaloscillators

•Opticaltransceivers

usedinapplicationstostabilizethetemperatureofsensitiveopticalcomponentsintelecomand

photonicsindustries.

Thisproductlineisavailableinmultipleconfigurationsandsurfacefinishingoptions.Assembledwith

BismuthTelluridesemiconductormaterialandthermallyconductiveAluminumOxideceramics,

designsareavailabletoaccommodatemetallization,pretinning,ceramicpatterns,andsolderposts,

howeverMOQapplies.

PERFORMANCE SPECIFICATIONS

Hotsidetemperature(°C)

25

50

Qmax(watts)

5.3

5.9

DeltaTmax(°C)

67

77

Imax(amps)

1.2

1.2

Vmax(volts)

7.4

8.4

Moduleresistance(ohms)

5.65

6.37

SUFFIX SEALANT

COLOR

TEMP RANGE DESCRIPTION

RT

RTV

White

-60to204°C

Non-corrosive,siliconeadhesivesealant

EP

Epoxy

Black

-55to150°C

Lowdensitysyntacticfoamepoxyencapsulant

SEALING OPTION