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MB3800 Datasheet(PDF) 19 Page - Cypress Semiconductor |
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MB3800 Datasheet(HTML) 19 Page - Cypress Semiconductor |
19 / 21 page MB3800 Document Number: 002-08716 Rev. *A Page 19 of 21 (Continued) 8-pin plastic SOP Lead pitch 1.27 mm Package width × package length 3.9 × 5.05 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.75 mm MAX Weight 0.06 g 8-pin plastic SOP (FPT-8P-M02) (FPT-8P-M02) C 2002 FUJITSU LIMITED F08004S-c-4-7 1.27(.050) 3.90±0.30 6.00±0.40 .199 –.008 +.010 –0.20 +0.25 5.05 0.13(.005) M (.154±.012) (.236±.016) 0.10(.004) 14 5 8 0.44±0.08 (.017±.003) –0.07 +0.03 0.22 .009 +.001 –.003 45˚ 0.40(.016) "A" 0~8˚ 0.25(.010) (Mounting height) Details of "A" part 1.55±0.20 (.061±.008) 0.50±0.20 (.020±.008) 0.60±0.15 (.024±.006) 0.15±0.10 (.006±.004) (Stand off) 0.10(.004) *1 *2 Dimensions in mm (inches). Note: The values in parentheses are reference values. Note 1) *1 : These dimensions include resin protrusion. Note 2) *2 : These dimensions do not include resin protrusion. Note 3)Pins width and pins thickness include plating thickness. Note 4) Pins width do not include tie bar cutting remainder. |
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