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MB3800 Datasheet(PDF) 18 Page - Cypress Semiconductor |
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MB3800 Datasheet(HTML) 18 Page - Cypress Semiconductor |
18 / 21 page MB3800 Document Number: 002-08716 Rev. *A Page 18 of 21 18. Package Dimensions (Continued) 8-pin plastic SOP Lead pitch 1.27 mm Package width × package length 5.3 × 6.35 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 2.25 mm MAX Weight 0.10 g Code (Reference) P-SOP8-5.3 ×6.35-1.27 8-pin plastic SOP (FPT-8P-M01) (FPT-8P-M01) C 2002 FUJITSU LIMITED F08002S-c-6-7 0.13(.005) M Details of "A" part 7.80±0.40 5.30±0.30 (.209±.012) (.307±.016) .250 –.008 +.010 –0.20 +0.25 6.35 INDEX 1.27(.050) 0.10(.004) 14 5 8 0.47±0.08 (.019±.003) –0.04 +0.03 0.17 .007 +.001 –.002 "A" 0.25(.010) (Stand off) 0~8˚ (Mounting height) 2.00 +0.25 –0.15 .079 +.010 –.006 0.50±0.20 (.020±.008) 0.60±0.15 (.024±.006) 0.10 +0.10 –0.05 –.002 +.004 .004 *1 0.10(.004) *2 Dimensions in mm (inches). Note: The values in parentheses are reference values. Note 1) *1 : These dimensions include resin protrusion. Note 2) *2 : These dimensions do not include resin protrusion. Note 3)Pins width and pins thickness include plating thickness. Note 4) Pins width do not include tie bar cutting remainder. |
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