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61SP6464 Datasheet(PDF) 8 Page - Integrated Silicon Solution, Inc |
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61SP6464 Datasheet(HTML) 8 Page - Integrated Silicon Solution, Inc |
8 / 19 page ![]() IS61SP6464 ISSI® 8 Integrated Silicon Solution, Inc. — 1-800-379-4774 Rev. C 01/14/04 POWER SUPPLY CHARACTERISTICS (Over Operating Range) -117 -100 Symbol Parameter Test Conditions Max. Max. Unit ICC AC Operating Device Selected, Com. 270 250 mA Supply Current All Inputs = VIL or VIH Ind. 270 OE = VIH, Cycle Time ≥ tKC min. ISB1 Standby Current Device Deselected, Com. 70 70 mA TTL Inputs VDD = Max., Ind. 80 All Inputs = VIH or VIL CLK Cycle Time ≥ tKC min. ISB2 Standby Current Device Deselected, Com. 20 20 mA CMOS Inputs VDD = Max., Ind. 30 VIN ≥ VDD – 0.2V, or VIN ≤ 0.2V CLK Cycle Time ≥ tKC min. IZZ Power-Down Mode ZZ = VDDQ, CLK Running Com. 20 20 mA Current All Inputs ≤ GND + 0.2V Ind. 30 or ≥ VDD – 0.2V Notes: 1. The MODE pin has an internal pullup. ZZ pin has an internal pull-down. This pin may be a No Connect, tied to GND, or tied to VDDQ. 2. The MODE pin should be tied to VDD or GND. It exhibits ±10 µA maximum leakage current when tied to ≤ GND + 0.2V or ≥ VDD – 0.2V. |
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