SF-1206F Series - Fast Acting Surface Mount Fuses

Solder Reflow Recommendations

Peak: 250 +0/-5 °C

230 °C or higher

PRE-HEATING ZONE

SOLDERING ZONE

HEATING TIME

180 °C

250

200

150

100

50

150 °C

90 ± 30 Seconds

30 ± 10 Seconds

PEAK: 250 +0/-5 °C, 5 seconds

PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds

SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds

Product Dimensions

Recommended Pad Layout

DIMENSIONS:

MM

(INCHES)

Thermal Derating Curve

120

110

100

90

80

-20

0

20

40

AMBIENT TEMPERATURE (°C)

60

80

100

120

Construction & Material Content

OVERCOAT

Sn PLATING

CERAMIC SUBSTRATE

FUSE ELEMENT

Cu / Ni PLATING

PACKAGING: 5,000 pcs./reel

3.1 ± 0.1

(.122 ± .004)

0.5 ± 0.3

(.020 ± .012)

0.5 ± 0.3

(.020 ± .012)

1.55 ± 0.1

(.061 ± .004)

0.5 ± 0.2

(.020 ± .008)

0.5 ± 0.2

(.020 ± .008)

0.6 ± 0.1

(.024 ± .004)

2.03

(.080)

3.81

(.150)

1.27

(.050)

Operating Temperature..................................................................................-40 °C to +105 °C

Storage Conditions

Temperature ................................................................................................+5 °C to +35 °C

Humidity...........................................................................................................40 % to 75 %

Shelf Life........................................................................... 2 years from manufacturing date

Specifications are subject to change without notice.

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.

Users should verify actual device performance in their specific applications.