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HI-5046A Datasheet(PDF) 9 Page - Intersil Corporation |
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HI-5046A Datasheet(HTML) 9 Page - Intersil Corporation |
9 / 12 page HI-5046A/883 9 FN8274.0 May 3, 2012 Die Characteristics DIE DIMENSIONS: 96mils x 81mils x 19mils (2430µm x 2050µm x 480µm METALLIZATION: Type: Aluminum Thickness: 16k Å ±2kÅ GLASSIVATION: Type: Nitride over Silox Silox Thickness: 12k Å ±2kÅ Nitride Thickness: 3.5k Å ±1kÅ SUBSTRATE POTENTIAL (Powered-up): V- DEVICE COUNT: 82 WORST CASE CURRENT DENSITY: 1.0 x 105A/cm2 at 20mA Metallization Mask Layout HI-5046A/883 NOTE: Unused pins may be connected. Ground all unused pins. V- VR VL V+ D1 S1 S4 D4 D2 S2 A S3 D3 |
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