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IDT71V546S Datasheet(PDF) 14 Page - Integrated Device Technology

Part # IDT71V546S
Description  3.3V Synchronous SRAM
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Manufacturer  IDT [Integrated Device Technology]
Direct Link  http://www.idt.com
Logo IDT - Integrated Device Technology

IDT71V546S Datasheet(HTML) 14 Page - Integrated Device Technology

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14
IDT71V546, 128K x 36, 3.3V Synchronous SRAM with
ZBT
™ Feature, Burst Counter and Pipelined Outputs
Commercial and Industrial Temperature Ranges
AC Electrical Characteristics
(VDD = 3.3V +/-5%, Commercial and Industrial Temperature Ranges)
NOTES:
1. tF = 1/tCYC.
2. Measured as HIGH above 2.0V and LOW below 0.8V.
3. Transition is measured ±200mV from steady-state.
4. These parameters are guaranteed with the AC load (Figure 1) by device characterization. They are not production tested.
5. To avoid bus contention, the output buffers are designed such that tCHZ (device turn-off) is about 2 ns faster than tCLZ (device turn-on) at a given temperature and voltage.
The specs as shown do not imply bus contention because tCLZ is a Min. parameter that is worse case at totally different test conditions (0 deg. C, 3.465V) than tCHZ,
which is a Max. parameter (worse case at 70 deg. C, 3.135V).
Symbol
Parameter
71V546S133
71V546S117
71V546S100
Unit
Min.
Max.
Min.
Max.
Min.
Max.
Clock Parameters
tCYC
Clock Cycle Time
7.5
____
8.5
____
10
____
ns
tF(1)
Clock Frequency
____
133
____
117
____
100
MHz
tCH(2)
Clock High Pulse Width
2.5
____
3
____
3.5
____
ns
tCL(2)
Clock Low Pulse Width
2.5
____
3
____
3.6
____
ns
Output Parameters
tCD
Clock High to Valid Data
____
4.2
____
4.5
____
5ns
tCDC
Clock High to Data Change
1.5
____
1.5
____
1.5
____
ns
tCLZ(3,4,5)
Clock High to Output Active
1.5
____
1.5
____
1.5
____
ns
tCHZ(3,4,5)
Clock High to Data High-Z
1.5
3.5
1.5
3.5
1.5
3.5
ns
tOE
Output Enable Access Time
____
4.2
____
4.5
____
5ns
tOLZ(3,4)
Output Enable Low to Data Active
0
____
0
____
0
____
ns
tOHZ(3.4)
Output Enable High to Data High-Z
____
3.5
____
3.5
____
3.5
ns
Setup Times
tSE
Clock Enable Setup Time
2.0
____
2.0
____
2.2
____
ns
tSA
Address Setup Time
2.0
____
2.0
____
2.2
____
ns
tSD
Data in Setup Time
1.7
____
1.7
____
2.0
____
ns
tSW
Read/Write (R/W) Setup Time
2.0
____
2.0
____
2.2
____
ns
tSADV
Advance/Load (ADV/LD) Setup Time
2.0
____
2.0
____
2.2
____
ns
tSC
Chip Enable/Select Setup Time
2.0
____
2.0
____
2.2
____
ns
tSB
Byte Write Enable (BWx) Setup Time
2.0
____
2.0
____
2.2
____
ns
Hold Times
tHE
Clock Enable Hold Time
0.5
____
0.5
____
0.5
____
ns
tHA
Address Hold Time
0.5
____
0.5
____
0.5
____
ns
tHD
Data in Hold Time
0.5
____
0.5
____
0.5
____
ns
tHW
Read/Write (R/W) Hold Time
0.5
____
0.5
____
0.5
____
ns
tHADV
Advance/Load (ADV/LD) Hold Time
0.5
____
0.5
____
0.5
____
ns
tHC
Chip Enable/Select Hold Time
0.5
____
0.5
____
0.5
____
ns
tHB
Byte Write Enable (BWx) Hold Time
0.5
____
0.5
____
0.5
____
ns
3821 tbl 23


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