IDT71T75702_09 datasheet(6/26 Pages) IDT

Part #	IDT71T75702

Description	Synchronous ZBT SRAMs

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Manufacturer	IDT [Integrated Device Technology]

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IDT71T75702, IDT71T75902, 512K x 36, 1M x 18, 2.5V Synchronous ZBT™ SRAMs with

2.5V I/O, Burst Counter and Flow-Through Outputs

Commercial and Industrial Temperature Ranges

Absolute Maximum Ratings(1)

TQFP Capacitance

(TA = +25°°°°°C, f = 1.0MHz)

Pin Configuration 1M x 18

NOTES:

1. Pins 14 and 66 do not have to be connected directly to VSS as long as the

input voltage is < VIL.

2. Pin 16 does not have to be connected directly to VDD as long as the input voltage

is > VIH.

3. Pins 38, 39 and 43 will be pulled internally to VDD if not actively driven. To

disable the TAP controller without interfering with normal operation, several

settings are possible. Pins 38, 39 and 43 could be tied to VDD or VSS and

pin 42 should be left unconnected. Or all JTAG inputs (TMS, TDI and TCK)

pins38, 39 and 43 could be left unconnected “NC” and the JTAG circuit will

remain disabled from power up.

4. Pin 43 is reserved for the 36M address. JTAG is not offered in the 100-pin

TQFP package for the 36M ZBT device.

Top View

100 TQFP

NOTE:

1. This parameter is guaranteed by device characterization, but not production tested.

NOTES:

1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may

cause permanent damage to the device. This is a stress rating only and functional

operation of the device at these or any other conditions above those indicated

in the operational sections of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect reliability.

2. VDD terminals only.

3. VDDQ terminals only.

4. Input terminals only.

5. I/O terminals only.

6. This is a steady-state DC parameter that applies after the power supply has

reached its nominal operating value. Power sequencing is not necessary;

however, the voltage on any input or I/O pin cannot exceed VDDQ during power

supply ramp up.

7. During production testing, the case temperature equals TA.

Symbol

Rating

Commercial

Industrial

Unit

VTERM

(2)

Terminal Voltage with

Respect to GND

-0.5 to +3.6

V

VTERM

(3,6)

Terminal Voltage with

Respect to GND

-0.5 to VDD

V

VTERM

(4,6)

Terminal Voltage with

Respect to GND

-0.5 to VDD +0.5

V

VTERM

(5,6)

Terminal Voltage with

Respect to GND

-0.5 to VDDQ +0.5

V

TA

(7)

Operating Ambient

Temperature

0 to +70

-40 to +85

oC

TBIAS

Temperature Under Bias

-55 to +125

oC

TSTG

Storage Temperature

-55 to +125

oC

PT

Power Dissipation

2.0

W

IOUT

DC Output Current

50

mA

5319 tbl 06

Symbol

Parameter

(1)

Conditions

Max.

Unit

CIN

Input Capacitance

VIN = 3dV

5

pF

CI/O

I/O Capacitance

VOUT = 3dV

7

pF

5319 tbl 07

100 999897 9695 9493 9291 90

8786858483 8281

89 88

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50

NC

VDDQ

VSS

NC

I/OP2

I/O15

I/O14

VSS

VDDQ

I/O13

I/O12

VSS

VDD

I/O11

I/O10

VDDQ

VSS

I/O9

I/O8

NC

VSS

VDDQ

NC

80

79

78

77

76

75

74

73

72

71

70

69

68

67

66

65

64

63

62

61

60

59

58

57

56

55

54

53

52

51

NC

VDDQ

VSS

NC

I/OP1

I/O7

I/O6

VSS

VDDQ

I/O5

I/O4

VSS

VDD

I/O3

I/O2

VDDQ

VSS

I/O1

I/O0

NC

VSS

VDDQ

NC

5319 drw 02a

VSS(1)

NC

VDD(2)

NC

VSS(1)

A10

ZZ

,

BGA Capacitance

(TA = +25°°°°°C, f = 1.0MHz)

Symbol

Parameter

(1)

Conditions

Max.

Unit

CIN

Input Capacitance

VIN = 3dV

7

pF

CI/O

I/O Capacitance

VOUT = 3dV

7

pF

5319 tbl 07a

fBGA Capacitance

(TA = +25°°°°°C, f = 1.0MHz)

Symbol

Parameter

(1)

Conditions

Max.

Unit

CIN

Input Capacitance

VIN = 3dV

7

pF

CI/O

I/O Capacitance

VOUT = 3dV

7

pF

5319 tbl 07b

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