15.225±0.125 Socket base size

12.725±0.050 (x4)

0.8500±0.0250 THRU

1.7000 THRU

3.75±0.03

3.75±0.03

4.53±0.03

3.8225

4.2500

15.725±0.125

Backing plate size

K

A1 corner

0.025 A B

B

A

0.22±0.03 (X130)

0.26±0.03 (X130)

0.52±0.03

0.45±0.03

DETAIL K

SCALE 20 : 1

Target PCB Recommendations

Total thickness: 1.6mm ± 10%

Pads: Hard Gold, ENIPIG,

RoHS HASL

Hard Gold spec:

50 Micro-Inches Gold over

200 Micro -Inches Nickel over

1/2-1 Oz copper

PCB Pad height: 0.0015" or

lower solder mask thickness

is acceptable.

Copper defined solder mask

and SMBOC is recommended

PCB IC foot print pads to match

the size and configuration of

LGA211 IC

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Recommended PCB Layout

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 11/23/2015

Material: Material <not specified>

Finish: N/A

Weight: 9.33

GT-QFN-3013 Drawing

SCALE: 6:1

SHEET: 2 OF 5

ENG: V. Panavala

FILE: GT-QFN-3013 Dwg

DRAWN BY: M. Raske