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ADUCM322I Datasheet(PDF) 23 Page - Analog Devices |
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ADUCM322I Datasheet(HTML) 23 Page - Analog Devices |
23 / 23 page Data Sheet ADuCM322i Rev. 0 | Page 23 of 23 PACKAGING AND ORDERING INFORMATION OUTLINE DIMENSIONS Figure 14. 96-Ball Chip Scale Package Ball Grid Array [CSP_BGA] (BC-96-2) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Description Package Option Downloader Ordering Quantity ADuCM322BBCZI −40°C to +105°C 96-Ball CSP_BGA BC-96-2 I2C 429 ADuCM322BBCZI-RL −40°C to +105°C 96-Ball CSP_BGA BC-96-2 I2C 2500 1 Z = RoHS Compliant Part. I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors). 6.10 6.00 SQ 5.90 5.00 REF SQ 0.35 0.30 0.25 COPLANARITY 0.08 A B C D E F G H J K L 7 63 21 5 4 BALL DIAMETER 0.50 BSC 0.50 REF DETAIL A A1 BALL CORNER A1 BALL CORNER DETAIL A BOTTOM VIEW TOP VIEW SEATING PLANE 1.200 1.083 1.000 8 9 10 11 COMPLIANT TO JEDEC STANDARDS MO-195-AC WITH THE EXCEPTION TO BALL COUNT. 0.223 NOM 0.173 MIN 0.93 0.86 0.79 ©2016 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D13986-0-2/16(0) www.analog.com/ADuCM322i |
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