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114-13219 Datasheet(PDF) 4 Page - TE Connectivity Ltd |
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114-13219 Datasheet(HTML) 4 Page - TE Connectivity Ltd |
4 / 10 page 114-13219 Rev C 4 of 10 THICKNESS PLATING 0.004-0.010 Hot Air Solder Leveling (HASL) Tin-Lead (Sn Pb) 0.0005-0.002 Immersion Tin (Sn) 0.0002-0.0005 Organic Solderability Preservative (OSP) 0.0001-0.0005 Au, 0.004-0.0076 Ni Immersion Gold (Au) Over Nickel (Ni) (ENIG) 0.0001-0.0005 Immersion Silver (Ag) Figure 2 Figure 3 (cont’d) Recommended Hole Dimensions For Cage Assembly Recommended Hole Dimensions For Connector 0.86 Ref Pad Diameter 0.54-0.58 Drilled Hole Diameter 1.13-1.17 Drilled Hole Diameter 0.46 Ref Finished Hole Diameter After Plating 1.05 Ref Finished Hole Diameter After Plating 0.025-0.050 Copper Plating (Max Hardness 150 Knoop) Plating (See Table) Plating (See Table) 0.025-0.050 Copper Plating (Max Hardness 150 Knoop) Light Pipe Pad Layout for 0805 Low Profile LED Package Keep-Out Zone (Detail G) NOTE: For a specific pc board layout, refer to the customer drawing for the specific connector and cage assembly. |
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