7

OPA317-Q1, OPA2317-Q1, OPA4317-Q1

www.ti.com

SLOS914 – JULY 2016

Product Folder Links: OPA317-Q1 OPA2317-Q1 OPA4317-Q1

Submit Documentation Feedback

Copyright © 2016, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information: OPA317-Q1

OPA317-Q1

UNIT

DBV (SOT-23)

5 PINS

Junction-to-ambient thermal resistance

220.8

°C/W

Junction-to-case (top) thermal resistance

97.5

°C/W

Junction-to-board thermal resistance

61.7

°C/W

Junction-to-top characterization parameter

7.6

°C/W

Junction-to-board characterization parameter

61.1

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information: OPA2317-Q1

OPA2317-Q1

UNIT

DGK (VSSOP)

8 PINS

Junction-to-ambient thermal resistance

180.3

°C/W

Junction-to-case (top) thermal resistance

48.1

°C/W

Junction-to-board thermal resistance

100.9

°C/W

Junction-to-top characterization parameter

2.4

°C/W

Junction-to-board characterization parameter

99.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.6 Thermal Information: OPA4317-Q1

OPA4317-Q1

UNIT

PW (TSSOP)

14 PINS

Junction-to-ambient thermal resistance

120.8

°C/W

Junction-to-case (top) thermal resistance

34.3

°C/W

Junction-to-board thermal resistance

62.8

°C/W

Junction-to-top characterization parameter

1

°C/W

Junction-to-board characterization parameter

56.5

°C/W