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HSDL3208 Datasheet(PDF) 2 Page - Agilent(Hewlett-Packard) |
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HSDL3208 Datasheet(HTML) 2 Page - Agilent(Hewlett-Packard) |
2 / 18 page ![]() 2 Application Support Information The Application Engineering group in Agilent Technologies is available to assist you with the technical understanding Order Information Part Number Packaging Type Package Quantity HSDL-3208-021 Tape and Reel Front View 2500 Recommended Application Circuit Components Component Recommended Value Notes R1 2.7 Ω ± 5%, 0.25 Watt for 2.7 <= VCC <= 3.6 V CX1 0.47 µF ± 20%, X7R Ceramic 8 CX2 6.8 µF ± 20%, Tantalum 9 Notes: 8. CX1 must be placed within 0.7 cm of the HSDL-3208 to obtain optimum noise immunity. 9. In environments with noisy power supplies, supply rejection performance can be enhanced by including CX2, as shown in “Figure 1: HSDL-3208 Functional Block Diagram” in Page 1. associated with HSDL-3208 infrared transceiver module. You can contact them through your local Agilent sales representatives for additional details. I/O Pins Configuration Table Pin Symbol Description I/O Type Notes 1 LED A LED Anode Input 1 2 LED C LED Cathode Input 2 3 TXD Transmit Data Input, Active High 3 4 RXD Receive Data Output, Active Low 4 5 SD/Mode Shutdown Input, Active High 5 6VCC Supply Voltage Supply Voltage 6 7 GND Ground Ground 7 Notes: 1. This pin can be connected directly to VCC (i.e. without series resistor) at less than 3 V. 2. Internally connected to the LED driver. 3. This pin is used to transmit serial data when SD pin is low. Do not float the pin. 4. This pin is capable of driving a standard CMOS or TTL load. No external pull-up or pull down resistor is required. It is in tri-state mode when the transceiver is in shutdown mode. 5. The transceiver is in shutdown mode if this pin is high. Do not float the pin. 6. Regulated, 2.7 to 3.6 volts. 7. Connect to system ground. |
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