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HSDL3208 Datasheet(PDF) 10 Page - Agilent(Hewlett-Packard) |
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HSDL3208 Datasheet(HTML) 10 Page - Agilent(Hewlett-Packard) |
10 / 18 page ![]() 10 1.0 Solder Pad, Mask and Metal Stencil Aperture Figure 14. Stencil and PCBA. 1.1 Recommended Land Pattern Figure 15. Stencil and PCBA. METAL STENCIL FOR SOLDER PASTE PRINTING LAND PATTERN PCBA STENCIL APERTURE SOLDER MASK Appendix A : SMT Assembly Application Note 0.60 1.75 0.10 0.95 1.9 CL MOUNTING CENTER FIDUCIAL 0.775 2.85 UNIT: mm |
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