HSDL3208 datasheet(8/18 Pages) HP

Part #	HSDL3208

Description	Ultra Small Profile Package IrDA Data Compliant Low Power 115.2 kbit/s Infrared Transceiver

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Manufacturer	HP [Agilent(Hewlett-Packard)]

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8

Moisture Proof Packaging

All HSDL-3208 options are

shipped in moisture proof

package. Once opened, moisture

absorption begins.

This part is compliant to JEDEC

Level 4.

Baking Conditions

If the parts are not stored in dry

conditions, they must be baked

before reflow to prevent damage

to the parts.

Package

Temp.

Time

In reels

60

°C

≥ 48 hours

In bulk

100

°C

≥ 4 hours

125

°C

≥ 2 hours

150

°C

≥ 1 hour

Baking should only be done once.

Recommended Storage Conditions

Storage

10

°C to 30°C

Temperature

Relative

below 60% RH

Humidity

Time from Unsealing to Soldering

After removal from the bag, the

parts should be soldered within

two days if stored at the recom-

mended storage conditions. If

times longer than 72 hours are

needed, the parts must be stored

in a dry box.

Figure 12. Baking conditions chart.

UNITS IN A SEALED

MOISTURE-PROOF

PACKAGE

PACKAGE IS

OPENED (UNSEALED)

ENVIRONMENT

LESS THAN 30°C,

AND LESS THAN

60% RH

PACKAGE IS

OPENED LESS

THAN 72 HOURS

PERFORM RECOMMENDED

BAKING CONDITIONS

NO BAKING

IS NECESSARY

YES

NO

YES

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HSDL3208 Datasheet(PDF) 8 Page - Agilent(Hewlett-Packard)

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