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NLX2G16 Datasheet(PDF) 6 Page - ON Semiconductor |
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NLX2G16 Datasheet(HTML) 6 Page - ON Semiconductor |
6 / 7 page NLX2G16 www.onsemi.com 6 PACKAGE DIMENSIONS UDFN6 1.45x1.0, 0.5P CASE 517AQ ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. A B E D BOTTOM VIEW b e 6X 0.10 B 0.05 A C C L 6X NOTE 3 0.10 C PIN ONE REFERENCE TOP VIEW 0.10 C 6X A A1 0.05 C 0.05 C C SEATING PLANE SIDE VIEW 1 3 4 6 DIM MIN MAX MILLIMETERS A 0.45 0.55 A1 0.00 0.05 b 0.20 0.30 D 1.45 BSC E 1.00 BSC e 0.50 BSC L 0.30 0.40 L1 −−− 0.15 DIMENSIONS: MILLIMETERS 0.30 6X 1.24 0.53 PITCH *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 0.50 1 MOUNTING FOOTPRINT PACKAGE OUTLINE L1 DETAIL A L OPTIONAL CONSTRUCTIONS L DETAIL B MOLD CMPD EXPOSED Cu OPTIONAL CONSTRUCTIONS A2 0.07 REF 6X A2 DETAIL B DETAIL A |
Similar Part No. - NLX2G16_16 |
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Similar Description - NLX2G16_16 |
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