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LM2595 Datasheet(PDF) 22 Page - National Semiconductor (TI) |
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LM2595 Datasheet(HTML) 22 Page - National Semiconductor (TI) |
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22 / 29 page  Application Information (Continued) but with copper areas greater than approximately 3 in 2, only small improvements in heat dissipation are realized. If fur- ther thermal improvements are needed, double sided or mul- tilayer PC-board with large copper areas are recommended. The curves shown in Figure 20 show the LM2595S (TO-263 package) junction temperature rise above ambient tempera- ture with a 1A load for various input and output voltages. This data was taken with the circuit operating as a buck switching regulator with all components mounted on a PC board to simulate the junction temperature under actual operating conditions. This curve can be used for a quick check for the approximate junction temperature for various conditions, but be aware that there are many factors that can affect the junc- tion temperature. For the best thermal performance, wide copper traces and generous amounts of printed circuit board copper should be used in the board layout. (One exception to this is the output (switch) pin, which should not have large areas of copper.) Large areas of copper provide the best transfer of heat (lower thermal resistance) to the surrounding air, and moving air lowers the thermal resistance even further. Package thermal resistance and junction temperature rise numbers are all approximate, and there are many factors that will affect these numbers. Some of these factors include board size, shape, thickness, position, location, and even board temperature. Other factors are, trace width, total printed circuit copper area, copper thickness, single- or double-sided, multilayer board and the amount of solder on the board. The effectiveness of the PC board to dissipate heat also depends on the size, quantity and spacing of other components on the board, as well as whether the surround- ing air is still or moving. Furthermore, some of these compo- nents such as the catch diode will add heat to the PC board and the heat can vary as the input voltage changes. For the inductor, depending on the physical size, type of core mate- rial and the DC resistance, it could either act as a heat sink taking heat away from the board, or it could add heat to the board. DS012565-34 Circuit Data for Temperature Rise Curve TO-220 Package (T) Capacitors Through hole electrolytic Inductor Through hole, Schott, 68 µH Diode Through hole, 3A 40V, Schottky PC board 3 square inches single sided 2 oz. copper (0.0028") FIGURE 19. Junction Temperature Rise, TO-220 DS012565-35 Circuit Data for Temperature Rise Curve TO-263 Package (S) Capacitors Surface mount tantalum, molded “D” size Inductor Surface mount, Schott, 68 µH Diode Surface mount, 3A 40V, Schottky PC board 3 square inches single sided 2 oz. copper (0.0028") FIGURE 20. Junction Temperature Rise, TO-263 www.national.com 22 |
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