4

CDCLVP111-SP

SCAS946 – NOVEMBER 2016

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

see

(1)

MIN

MAX

UNIT

–0.3

4.6

V

Input voltage

–0.3

V

Output voltage

–0.3

V

Input current

±20

mA

–4.6

0.3

V

Sink/source current

–1

1

mA

DC output current

–50

mA

Maximum operating junction temperature

150

°C

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

±1000

6.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

2.375

2.5/3.3

3.8

V

Operating junction temperature

–55

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

According to JESD 51-7 standard.

6.4 Thermal Information

CDCLVP111-SP

UNIT

HFG (CFP)

36 PINS

107.2

°C/W

Junction-to-case (top) thermal resistance

33.2

°C/W

Junction-to-board thermal resistance

98.9

°C/W

Junction-to-top characterization parameter

29.2

°C/W

Junction-to-board characterization parameter

91.36

°C/W

Junction-to-case (bottom) thermal resistance

13.4

°C/W