Board

Supply

Chip

Supply

C

10 F

m

C

1 F

m

C

0.1 F(x3)

m

FerriteBead

V

CC

18

CDCLVP111-SP

SCAS946 – NOVEMBER 2016

www.ti.com

Product Folder Links: CDCLVP111-SP

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Copyright © 2016, Texas Instruments Incorporated

9 Power Supply Recommendations

9.1 Power-Supply Filtering

High-performance clock buffers are sensitive to noise on the power supply, which can dramatically increase the

additive jitter of the buffer. Thus, it is essential to reduce noise from the system power supply, especially when

jitter and phase noise are very critical to applications.

Filter capacitors are used to eliminate the low-frequency noise from the power supply, where the bypass

capacitors provide the very low-impedance path for high-frequency noise and guard the power-supply system

against the induced fluctuations. These bypass capacitors also provide instantaneous current surges as required

by the device and should have low equivalent series resistance (ESR). To properly use the bypass capacitors,

they must be placed very close to the power-supply terminals and laid out with short loops to minimize

inductance. TI recommends to add as many high-frequency (for example, 0.1-μF) bypass capacitors as there are

supply terminals in the package.

TI recommends, but does not require, to insert a ferrite bead between the board power supply and the chip

power supply that isolates the high-frequency switching noises generated by the clock driver; these beads

prevent the switching noise from leaking into the board supply. It is imperative to choose an appropriate ferrite

bead with very low DC resistance to provide adequate isolation between the board supply and the chip supply,

as well as to maintain a voltage at the supply terminals that is greater than the minimum voltage required for

proper operation.

Figure 16 illustrates this recommended power-supply decoupling method.

Figure 16. Power-Supply Decoupling