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BJ5FCWFP-E2 Datasheet(PDF) 28 Page - Rohm |
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BJ5FCWFP-E2 Datasheet(HTML) 28 Page - Rohm |
28 / 42 page ![]() 28/38 BDxxFC0 series Datasheet Datasheet TSZ02201-0G2G0A600040-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 16.May.2016 Rev.004 www.rohm.com TSZ22111・15・001 ●Thermal Design ■ HTSOP-J8 Figure 74. ■ TO252-3/5 Figure 75. IC mounted on ROHM standard board based on JEDEC. Board material: FR4 Board size 1s 114.3 mm x 76.2 mm x 1.57 mmt 2s2p 114.3 mm x 76.2 mm x 1.6 mmt Mount condition: PCB and exposed pad are soldered. Top copper foil: The footprint ROHM recommend. + wiring to measure. ①: 1-layer PCB (Copper foil area on the reverse side of PCB: 0 mm x 0 mm) ②: 4-layer PCB (2 inner layers and copper foil area on the reverse side of PCB: 74.2mm x 74.2 mm) Condition ①: θja = 206.4 °C/W, ΨJT = 21°C/W Condition ②: θja = 45.2 °C/W, ΨJT = 13°C/W IC mounted on ROHM standard board based on JEDEC. Board material: FR4 Board size 1s 114.3 mm x 76.2 mm x 1.57 mmt 2s2p 114.3 mm x 76.2 mm x 1.6 mmt Mount condition: PCB and exposed pad are soldered. Top copper foil: The footprint ROHM recommend. + wiring to measure. ①: 1-layer PCB (Copper foil area on the reverse side of PCB: 0 mm x 0 mm) ②: 4-layer PCB (2 inner layers and copper foil area on the reverse side of PCB: 74.2mm x 74.2 mm) Condition ①: θja = 115.3 °C/W, ΨJT = 14°C/W Condition ②: θja = 20.8 °C/W, ΨJT = 3°C/W When operating at temperature more than Ta=25°C, please refer to the power dissipation characteristic curve shown in Figure 74 and 75. The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC at temperatures less than the maximum junction temperature Tjmax. Figure 74 and 75 show the acceptable power dissipation characteristic curves of the HTSOP-J8 and TO252-3/5 packages. Even when the ambient temperature (Ta) is at normal temperature (25°C), the chip junction temperature (Tj) may be quite high so please operate the IC at temperatures less than the acceptable power dissipation. The calculation method for power consumption Pc(W) is as follows Pc=(Vcc-Vo)×Io+Vcc×Icc Acceptable loss Pd ≥ Pc Solving this for load current Io in order to operate within the acceptable loss It is then possible to find the maximum load current Iomax with respect to the applied voltage Vcc at the time of thermal design. Calculation Example) When TO252-3 / TO252-5, Ta=85°C, Vcc=13.5V, Vo=5.0V Io ≤ Pd-Vcc×Icc Vcc-Vo Vcc : Input voltage Vo : Output voltage Io : Load current Icc : Circuit current Io ≤ 365.6mA (Icc : 0.5mA) Io ≤ 3.115-13.5×Icc 8.5 Figure 75 ②θja=20.8 °C/W → -48.1mW/°C 25°C = 6W → 85°C =3.115W ② 2.8 W ① 0.6W 0 0.5 1 1.5 2 2.5 3 3.5 0 255075 100 125 150 Ambient Temperature: Ta[°C] ② 6W ① 1.1 W 0 2 4 6 8 0 255075 100 125 150 Ambient Temperature: Ta [°C] |
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