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BJ5FCWFP-E2 Datasheet(PDF) 28 Page - Rohm

Part # BJ5FCWFP-E2
Description  35V Withstand Voltage 1A LDO Regulators
Download  42 Pages
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Manufacturer  ROHM [Rohm]
Direct Link  http://www.rohm.com
Logo ROHM - Rohm

BJ5FCWFP-E2 Datasheet(HTML) 28 Page - Rohm

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BDxxFC0 series
Datasheet
Datasheet
TSZ02201-0G2G0A600040-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
16.May.2016 Rev.004
www.rohm.com
TSZ22111・15・001
●Thermal Design
HTSOP-J8
Figure 74.
TO252-3/5
Figure 75.
IC mounted on ROHM standard board based on JEDEC.
Board material: FR4
Board size
1s
114.3 mm x 76.2 mm x 1.57 mmt
2s2p
114.3 mm x 76.2 mm x 1.6 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: The footprint ROHM recommend.
+ wiring to measure.
①: 1-layer PCB (Copper foil area on the reverse side of
PCB: 0 mm x 0 mm)
②: 4-layer PCB (2 inner layers and copper foil area on the
reverse side of PCB: 74.2mm x 74.2 mm)
Condition
①: θja = 206.4 °C/W, ΨJT = 21°C/W
Condition
②: θja = 45.2 °C/W, ΨJT = 13°C/W
IC mounted on ROHM standard board based on JEDEC.
Board material: FR4
Board size
1s
114.3 mm x 76.2 mm x 1.57 mmt
2s2p
114.3 mm x 76.2 mm x 1.6 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: The footprint ROHM recommend.
+ wiring to measure.
①: 1-layer PCB (Copper foil area on the reverse side of
PCB: 0 mm x 0 mm)
②: 4-layer PCB (2 inner layers and copper foil area on the
reverse side of PCB: 74.2mm x 74.2 mm)
Condition
①: θja = 115.3 °C/W, ΨJT = 14°C/W
Condition
②: θja = 20.8 °C/W, ΨJT = 3°C/W
When operating at temperature more than Ta=25°C, please refer to the power dissipation characteristic curve shown in Figure
74 and 75.
The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC at
temperatures less than the maximum junction temperature Tjmax.
Figure 74 and 75 show the acceptable power dissipation characteristic curves of the HTSOP-J8 and TO252-3/5 packages. Even
when the ambient temperature (Ta) is at normal temperature (25°C), the chip junction temperature (Tj) may be quite high so
please operate the IC at temperatures less than the acceptable power dissipation.
The calculation method for power consumption Pc(W) is as follows
Pc=(Vcc-Vo)×Io+Vcc×Icc
Acceptable loss Pd ≥ Pc
Solving this for load current Io in order to operate within the acceptable loss
It is then possible to find the maximum load current Iomax with respect to the applied voltage Vcc at the time of thermal design.
Calculation Example) When TO252-3 / TO252-5, Ta=85°C, Vcc=13.5V, Vo=5.0V
Io ≤
Pd-Vcc×Icc
Vcc-Vo
Vcc
: Input voltage
Vo
: Output voltage
Io
: Load current
Icc
: Circuit current
Io ≤ 365.6mA (Icc : 0.5mA)
Io ≤
3.115-13.5×Icc
8.5
Figure 75
②θja=20.8 °C/W → -48.1mW/°C
25°C = 6W → 85°C =3.115W
2.8 W
0.6W
0
0.5
1
1.5
2
2.5
3
3.5
0
255075
100
125
150
Ambient Temperature: Ta[°C]
6W
1.1 W
0
2
4
6
8
0
255075
100
125
150
Ambient Temperature: Ta [°C]


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