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MCP16251 Datasheet(PDF) 17 Page - Microchip Technology |
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MCP16251 Datasheet(HTML) 17 Page - Microchip Technology |
17 / 32 page 2013 - 2016 Microchip Technology Inc. DS20005173B-page 17 MCP16251/2 Another particular situation is powering a boost circuit from one rechargeable cell like NiMH or NiCd. These applications need an external MCU to monitor the cell voltage or a separate UVLO circuit to prevent deep discharging, which results in permanent cell damage. In a multi-cell powered application (e.g., 2.4V typ. from two NiMH cells) deep discharging will result in a reverse polarity charging of one of the cells due the unbalanced cell voltages, thus damaging the respective cell. 5.6.1 UVLO CIRCUIT FOR SINGLE-CELL APPLICATIONS In single-cell battery applications, it is not always possible to monitor the start-up and shut-down voltages using a MCU (due to MCU’s features or to I/O pin count limitations). One simple way to implement a ULVO circuit is a simple diode placed between the VIN pin (with anode) and EN pin (with cathode) and a bias resistor from EN to GND. Another example which shows an additional ultra low power undervoltage lockout (UVLO) circuit with Start and Stop thresholds is shown in Figure 5-3. Both thresholds are programmable (1.15V to start and 0.8V to stop the converter functionality) and new values can be easily calculated using Equations 5-3 and 5-4. The UVLO circuit consumes 0.5 µA up to max. 2 µA from one battery. FIGURE 5-3: UVLO Circuit Example of a Low Voltage Boost Converter with 1.15V Start and 0.8V Stop Thresholds. EQUATION 5-3: EQUATION 5-4: 5.7 Thermal Calculations The MCP16251/2 is available in two different packages (SOT-23-6 and 2x3x0.8 TDFN-8). By calculating the power dissipation and applying the package thermal resistance ( JA), the junction temperature is estimated. The maximum continuous junction temperature rating for the MCP16251/2 family of devices is +125°C. To quickly estimate the internal power dissipation for the switching boost regulator, an empirical calculation using measured efficiency can be used. Given the measured efficiency, the internal power dissipation is estimated by Equation 5-5. EQUATION 5-5: The difference between the first term, input power, and the second term, power delivered, is the internal MCP16251/2 power dissipation. This is an estimate which assumes that most of the power lost is internal to the MCP16251/2 and not to the CIN, COUT and/or the inductor. There is some percentage of power lost in the boost inductor, with very little loss in the input and output capacitors. For a more accurate estimation of internal power dissipation, subtract the IINRMS 2 x L ESR power dissipation. 5.8 PCB Layout Information Good printed circuit board layout techniques are important to any switching circuitry, and switching power supplies are no different. When wiring the switching high current paths, short and wide traces should be used. Therefore, it is important that the input and output capacitors be placed as close as possible to the MCP16251/2 to minimize the loop area. The feedback resistors and feedback signal should be routed away from the switching node and the switching current loop. When possible, ground planes and traces should be used to help shield the feedback signal and minimize noise and magnetic interference. 2M 2.2 M R2 R3 2.4 M R1 Q2 MMBT2222 3M R4 to VIN + - to EN 1M R5 MMBT2907 Q1 ULVO START 0.4 R 1 R 2 R 3 ++ R 1 ------------------------------------- ULVO STOP 0.4 R 1 R 2 + R 1 ------------------------ where: 0.4 is VEBQ1 for selected M resistors range. It increases to 0.6 if resistors are in k range. V OUT I OUT Efficiency ------------------------------- V OUT I OUT – P Dis = |
Similar Part No. - MCP16251_16 |
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Similar Description - MCP16251_16 |
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