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MCP16251 Datasheet(PDF) 17 Page - Microchip Technology

Part # MCP16251
Description  Low Quiescent Current, PFM/PWM Synchronous Boost Regulator with True Output Disconnect or Input/Output Bypass Option
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP16251 Datasheet(HTML) 17 Page - Microchip Technology

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 2013 - 2016 Microchip Technology Inc.
DS20005173B-page 17
MCP16251/2
Another particular situation is powering a boost circuit
from one rechargeable cell like NiMH or NiCd. These
applications need an external MCU to monitor the cell
voltage or a separate UVLO circuit to prevent deep
discharging, which results in permanent cell damage.
In a multi-cell powered application (e.g., 2.4V typ. from
two NiMH cells) deep discharging will result in a
reverse polarity charging of one of the cells due the
unbalanced
cell
voltages,
thus
damaging
the
respective cell.
5.6.1
UVLO CIRCUIT FOR SINGLE-CELL
APPLICATIONS
In single-cell battery applications, it is not always
possible to monitor the start-up and shut-down
voltages using a MCU (due to MCU’s features or to I/O
pin count limitations).
One simple way to implement a ULVO circuit is a
simple diode placed between the VIN pin (with anode)
and EN pin (with cathode) and a bias resistor from EN
to GND.
Another example which shows an additional ultra low
power undervoltage lockout (UVLO) circuit with Start
and Stop thresholds is shown in Figure 5-3. Both
thresholds are programmable (1.15V to start and 0.8V
to stop the converter functionality) and new values can
be easily calculated using Equations 5-3 and 5-4. The
UVLO circuit consumes 0.5 µA up to max. 2 µA from
one battery.
FIGURE 5-3:
UVLO Circuit Example of a
Low Voltage Boost Converter with 1.15V Start
and 0.8V Stop Thresholds.
EQUATION 5-3:
EQUATION 5-4:
5.7
Thermal Calculations
The MCP16251/2 is available in two different packages
(SOT-23-6 and 2x3x0.8 TDFN-8). By calculating the
power dissipation and applying the package thermal
resistance (
JA), the junction temperature is estimated.
The maximum continuous junction temperature rating
for the MCP16251/2 family of devices is +125°C.
To quickly estimate the internal power dissipation for
the switching boost regulator, an empirical calculation
using measured efficiency can be used. Given the
measured efficiency, the internal power dissipation is
estimated by Equation 5-5.
EQUATION 5-5:
The difference between the first term, input power, and
the second term, power delivered, is the internal
MCP16251/2 power dissipation. This is an estimate
which assumes that most of the power lost is internal to
the MCP16251/2 and not to the CIN, COUT and/or the
inductor. There is some percentage of power lost in the
boost inductor, with very little loss in the input and
output capacitors. For a more accurate estimation of
internal power dissipation, subtract the IINRMS
2 x L
ESR
power dissipation.
5.8
PCB Layout Information
Good printed circuit board layout techniques are
important to any switching circuitry, and switching
power supplies are no different. When wiring the
switching high current paths, short and wide traces
should be used. Therefore, it is important that the input
and output capacitors be placed as close as possible to
the MCP16251/2 to minimize the loop area.
The feedback resistors and feedback signal should be
routed away from the switching node and the switching
current loop. When possible, ground planes and traces
should be used to help shield the feedback signal and
minimize noise and magnetic interference.
2M
2.2 M
R2
R3
2.4 M
R1
Q2
MMBT2222
3M
R4
to VIN
+
-
to EN
1M
R5
MMBT2907
Q1
ULVO
START
0.4
R
1
R
2
R
3
++

R
1
-------------------------------------
ULVO
STOP
0.4
R
1
R
2
+

R
1
------------------------
where:
0.4 is VEBQ1 for selected M resistors range.
It increases to 0.6 if resistors are in k
 range.
V
OUT
I
OUT
Efficiency
-------------------------------


V
OUT
I
OUT

P
Dis
=


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