 2013 - 2016 Microchip Technology Inc.

DS20005173B-page 25

MCP16251/2

Microchip Technology Drawing No. C04-129-MNY Rev E Sheet 2 of 2

8-Lead Plastic Dual Flat, No Lead Package (MNY) – 2x3x0.8 mm Body [TDFN]

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

NOM

MILLIMETERS

0.50 BSC

2.00 BSC

3.00 BSC

0.20 REF

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Contact-to-Exposed Pad

Contact Thickness

Exposed Pad Width

Exposed Pad Length

4. Dimensioning and tolerancing per ASME Y14.5M

3. Package is saw singulated

2. Package may have one or more exposed tie bars at ends.

Notes:

Contact Width

Overall Width

Overall Length

Contact Length

Standoff

Number of Pins

Overall Height

Pitch

K

0.20

Units

N

e

A

Dimension Limits

D

A3

A1

b

D2

E2

E

L

0.20

1.35

1.25

0.25

0.00

0.70

MIN

-

-

0.25

0.30

1.30

1.40

1.35

0.30

0.45

1.45

8

0.75

0.02

0.05

0.80

MAX

With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN)