MCP16251/2

DS20005173B-page 24

 2013 - 2016 Microchip Technology Inc.

B

A

0.15 C

0.15 C

0.10

C A B

0.05

C

(DATUM B)

(DATUM A)

C

SEATING

PLANE

NOTE 1

12

N

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 1

12

N

0.10

C A B

0.10

C A B

0.10 C

0.08 C

Microchip Technology Drawing No. C04-129-MNY Rev E Sheet 1 of 2

2X

8X

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

8-Lead Plastic Dual Flat, No Lead Package (MNY) – 2x3x0.8 mm Body [TDFN]

D

E

D2

E2

A

(A3)

A1

e

8X b

L

K

With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN)