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MTC3588N6 Datasheet(PDF) 11 Page - Cystech Electonics Corp. |
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MTC3588N6 Datasheet(HTML) 11 Page - Cystech Electonics Corp. |
11 / 12 page ![]() CYStech Electronics Corp. Spec. No. : C102N6 Issued Date : 2015.08.13 Revised Date : 2016.10.11 Page No. : 11/12 MTC3588N6 CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3 C/second max. 3 C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100 C 150 C 60-120 seconds 150 C 200 C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183 C 60-150 seconds 217 C 60-150 seconds Peak Temperature(TP) 240 +0/-5 C 260 +0/-5 C Time within 5 C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6 C/second max. 6 C/second max. Time 25 C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. |
Similar Part No. - MTC3588N6_16 |
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Similar Description - MTC3588N6_16 |
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