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SC16C2550 Datasheet(PDF) 46 Page - NXP Semiconductors |
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SC16C2550 Datasheet(HTML) 46 Page - NXP Semiconductors |
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46 / 46 page  © Koninklijke Philips Electronics N.V. 2003. Printed in the U.S.A All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 19 June 2003 Document order number: 9397 750 11621 Contents Philips Semiconductors SC16C2550 Dual UART with 16 bytes of transmit and receive FIFOs and IrDA encoder/decoder 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6 6 Functional description . . . . . . . . . . . . . . . . . . . 9 6.1 UART A-B functions . . . . . . . . . . . . . . . . . . . . . 9 6.2 Internal registers . . . . . . . . . . . . . . . . . . . . . . . 10 6.3 FIFO operation . . . . . . . . . . . . . . . . . . . . . . . . 11 6.4 Hardware flow control . . . . . . . . . . . . . . . . . . . 11 6.5 Software flow control . . . . . . . . . . . . . . . . . . . 11 6.6 Special feature software flow control . . . . . . . 12 6.7 Hardware/software and time-out interrupts. . . 12 6.8 Programmable baud rate generator . . . . . . . . 13 6.9 DMA operation . . . . . . . . . . . . . . . . . . . . . . . . 14 6.10 Loop-back mode . . . . . . . . . . . . . . . . . . . . . . . 14 7 Register descriptions . . . . . . . . . . . . . . . . . . . 16 7.1 Transmit (THR) and Receive (RHR) Holding Registers . . . . . . . . . . . . . . . . . . . . . 17 7.2 Interrupt Enable Register (IER) . . . . . . . . . . . 17 7.2.1 IER versus Transmit/Receive FIFO interrupt mode operation . . . . . . . . . . . . . . . . . . . . . . . 18 7.2.2 IER versus Receive/Transmit FIFO polled mode operation . . . . . . . . . . . . . . . . . . . . . . . 19 7.3 FIFO Control Register (FCR) . . . . . . . . . . . . . 19 7.3.1 DMA mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 7.3.2 FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 7.4 Interrupt Status Register (ISR) . . . . . . . . . . . . 21 7.5 Line Control Register (LCR) . . . . . . . . . . . . . . 22 7.6 Modem Control Register (MCR) . . . . . . . . . . . 24 7.7 Line Status Register (LSR) . . . . . . . . . . . . . . . 25 7.8 Modem Status Register (MSR). . . . . . . . . . . . 26 7.9 Scratchpad Register (SPR) . . . . . . . . . . . . . . 27 7.10 Enhanced Feature Register (EFR) . . . . . . . . . 27 7.11 SC16C2550 external reset condition . . . . . . . 29 8 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 29 9 Static characteristics . . . . . . . . . . . . . . . . . . . 30 10 Dynamic characteristics . . . . . . . . . . . . . . . . . 31 10.1 Timing diagrams. . . . . . . . . . . . . . . . . . . . . . . 32 11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 39 12 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 12.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 42 12.2 Through-hole mount packages . . . . . . . . . . . 42 12.2.1 Soldering by dipping or by solder wave . . . . . 42 12.2.2 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 42 12.3 Surface mount packages . . . . . . . . . . . . . . . . 42 12.3.1 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 42 12.3.2 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 43 12.3.3 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 43 12.4 Package related soldering information . . . . . . 44 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . 44 14 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 45 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 |
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