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HSDL3602 Datasheet(PDF) 15 Page - Agilent(Hewlett-Packard) |
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HSDL3602 Datasheet(HTML) 15 Page - Agilent(Hewlett-Packard) |
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15 / 25 page  14 Figure 4. Solder paste stencil aperture. See Figure 4 t, nominal stencil thickness l, length of aperture mm inches mm inches 0.152 0.006 2.8 ± 0.05 0.110 ± 0.002 0.127 0.005 3.4 ± 0.05 0.134 ± 0.002 w, the width of aperture is fixed at 0.70 mm (0.028 inches) Aperture opening for shield pad is 2.8 mm x 2.35 mm as per land dimension. 2.0. Recommended solder paste/ cream volume for castellation joints Based on calculation and experi- ment, the printed solder paste volume required per castellation pad is 0.30 cubic mm (based on either no-clean or aqueous solder cream types with typically 60 to 65% solid content by volume). 2.1. Recommended Metal Solder Stencil Aperture It is recommended that only 0.152 mm (0.006 inches) or 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. This is to ensure ad- equate printed solder paste vol- ume and no shorting. The following combination of metal stencil aperture and metal stencil thickness should be used: 3.0. Pick and Place Misalignment Tolerance and Product Self-Align- ment after Solder Reflow If the printed solder paste volume is adequate, the unit will self- align in the X-direction after sol- der reflow. Units should be properly reflowed in IR Hot Air convection oven using the recom- mended reflow profile. The di- rection of board travel does not matter. APERTURE AS PER LAND SOLDER PASTE l w t (STENCIL THICKNESS) Allowable Misalignment Tolerance X-direction ≤ 0.2 mm (0.008 inches) Theta-direction ± 2 degrees |
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