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HSDL3602 Datasheet(PDF) 14 Page - Agilent(Hewlett-Packard) |
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HSDL3602 Datasheet(HTML) 14 Page - Agilent(Hewlett-Packard) |
14 / 25 page ![]() 13 • Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. •“h” is the minimum solder resist strip width required to 1.2. Adjacent Land Keep-out and Solder Mask Areas Dim. mm inches h min. 0.2 min. 0.008 j 13.4 0.528 k 4.7 0.185 l 3.2 0.126 h l Rx LENS Tx LENS j SOLDER MASK LAND k Y avoid solder bridging adjacent pads. • It is recommended that 2 fiducial cross be placed at mid-length of the pads for unit alignment. Note : Wet/Liquid Photo-Imagineable solder resist/mask is recommended. Figure 3. HSDL-3602-007/-037 PCBA-Adjacent land keep-out and solder mask. |
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