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HSDL3602 Datasheet(PDF) 13 Page - Agilent(Hewlett-Packard) |
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HSDL3602 Datasheet(HTML) 13 Page - Agilent(Hewlett-Packard) |
13 / 25 page 12 Dim. mm inches a 2.40 0.095 b 0.70 0.028 c (pitch) 1.10 0.043 d 2.35 0.093 e 2.80 0.110 f 3.13 0.123 g 4.31 0.170 Appendix A: HSDL-3602-007/-037 SMT Assembly Application Note 1.0. Solder Pad, Mask, and Metal Solder Stencil Aperture METAL STENCIL FOR SOLDER PASTE PRINTING LAND PATTERN PCBA STENCIL APERTURE SOLDER MASK Figure 1. Stencil and PCBA. 1.1. Recommended Land Pattern for HSDL-3602-007/-037 SHIELD SOLDER PAD a b f theta 10x PAD Y d e g Rx LENS Tx LENS FIDUCIAL X c FIDUCIAL Figure 2. Top view of land pattern. |
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Similar Description - HSDL3602 |
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