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OM25180FDKM Datasheet(PDF) 5 Page - NXP Semiconductors |
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OM25180FDKM Datasheet(HTML) 5 Page - NXP Semiconductors |
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5 / 149 page  PN5180 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.0 — 7 October 2016 240930 5 of 149 NXP Semiconductors PN5180 High-performance multi-protocol full NFC Forum-compliant frontend The PN5180 is not available with pre-installed firmware version 3.6. 8. Marking PN5180A0HN/C2, 518 HVQFN40 Firmware version 3.5. Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals + 1 central ground; body 6 x 6 x 1.0 mm; delivered on reel MSL = 3. SOT618-1 PN5180A0ET/C2, 151 TFBGA64 Firmware version 3.5. Plastic thin fine-pitch ball grid array package; 64 balls, delivered in one tray, MSL = 1. SOT1336-1 PN5180A0ET/C2, 118 TFBGA64 Firmware version 3.5. Plastic thin fine-pitch ball grid array package; 64 balls, delivered on reel, MSL = 1. SOT1336-1 Table 2. Ordering information Type number Package Name Description Version Table 3. Marking codes HVQFN40 Type number Marking code PN5180 (first Engineering prototypes) Line A: These devices are intended for prototype development only, PN51800 or PN5180A Line B1: “01... 01” or 6 characters: Diffusion Batch ID and assembly sequence ID Line B2: “FW 1.1” or ”Z.1 01” Line C: Engineering prototypes are marked “Product life cycle status code Before CQS”: X 8 characters: diffusion and assembly location, date code, product version (indicated by mask version), product life cycle status. This line includes the following elements at 8 positions: 1. Diffusion center code 2. Assembly center code 3. RHF-2006 indicator 4. Year code (Y) 1) 5. Week code (W) 2) 6. Week code (W) 2) 7. Mask layout version 8. (Product life cycle status code Before CQS) X PN5180 (devices are customer qualification samples) Line A: PN5180A Line B1: 6 characters: Diffusion Batch ID and assembly sequence ID Line B2: blank |
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