Electronic Components Datasheet Search |
|
OM25180FDKM Datasheet(PDF) 4 Page - NXP Semiconductors |
|
|
OM25180FDKM Datasheet(HTML) 4 Page - NXP Semiconductors |
4 / 149 page PN5180 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.0 — 7 October 2016 240930 4 of 149 NXP Semiconductors PN5180 High-performance multi-protocol full NFC Forum-compliant frontend Version 3.6: Automatic Receiver Control added No silicon initialized with this firmware is available. Usage of this firmware requires an update by the user. Version information: • EEPROM address 0x12: 0x06 • EEPROM address 0x13: 0x03 Changes of Version 3.6 compared to Version 2.5: • Accessible EEPROM top address is changed to 0xFE • EEPROM functional assignment starting at address 0xD8 • EEPROM updates to support using GPO1 during LPCD card detect and GPIO2 during wake-up from standby • Adaptive Receiver configuration (ARC) available: EEPROM table updates for receiver configuration • Energy of external RF field can be used to operate an external system-power-on switch 7. Ordering information Table 2. Ordering information Type number Package Name Description Version PN5180A0HN/C1, 551 HVQFN40 Firmware version 3.4. Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals + 1 central ground; body 6 x 6 x 1.0 mm; delivered in one tray, bakable, MSL=3. SOT618-1 PN5180A0HN/C1, 518 HVQFN40 Firmware version 3.4. Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals + 1 central ground; body 6 x 6 x 1.0 mm; delivered on reel MSL = 3. SOT618-1 PN5180A0ET/C1, 151 TFBGA64 Firmware version 3.4. Plastic thin fine-pitch ball grid array package; 64 balls, delivered in one tray, MSL = 1. SOT1336-1 PN5180A0ET/C1, 118 TFBGA64 Firmware version 3.4. Plastic thin fine-pitch ball grid array package; 64 balls, delivered on reel, MSL = 1. SOT1336-1 PN5180A0HN/C2, 551 HVQFN40 Firmware version 3.5. Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals + 1 central ground; body 6 x 6 x 1.0 mm; delivered in one tray, bakable, MSL=3. SOT618-1 |
Similar Part No. - OM25180FDKM |
|
Similar Description - OM25180FDKM |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |