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SCC68681C1A44 Datasheet(PDF) 20 Page - NXP Semiconductors |
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SCC68681C1A44 Datasheet(HTML) 20 Page - NXP Semiconductors |
20 / 29 page Philips Semiconductors Product data SCC68681 Dual asynchronous receiver/transmitter (DUART) 2004 Apr 06 20 ABSOLUTE MAXIMUM RATINGS1 SYMBOL PARAMETER RATING UNIT Tamb Operating ambient temperature range2 See Note 4 °C Tstg Storage temperature range –65 to +150 °C All voltages with respect to ground3 –0.5 to +6.0 V Maximum pin voltages VSS – 0.5 V to VCC + 0.5 V V NOTES: 1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other condition above those indicated in the operation section of this specification is not implied. 2. For operating at elevated temperatures, the device must be derated based on +150 °C maximum junction temperature. 3. This product includes circuitry specifically designed for the protection of its internal devices from damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying any voltages larger than the rated maxima. 4. Parameters are valid over specified temperature range. See Ordering information table for applicable operating temperature range and VCC supply range. DC ELECTRICAL CHARACTERISTICS1, 2, 3 Tamb = –40 °C to +85 °C; VCC = 5.0 V ± 10% SYMBOL PARAMETER TEST CONDITIONS LIMITS UNIT SYMBOL PARAMETER TEST CONDITIONS Min Typ Max UNIT VIL LOW-level input voltage – – 0.8 V VIH HIGH-level input voltage (except X1/CLK) Tamb ≥ 0 °C 2.0 – – V VIH HIGH-level input voltage (except X1/CLK) Tamb < 0 °C 2.5 – – V VIH HIGH-level input voltage (X1/CLK) 0.8 VCC – – V VOL LOW-level output voltage IOL = 2.4 mA – – 0.4 V VOH HIGH-level output voltage (except open-drain outputs)4 IOH = –400 µA VCC – 0.5 – – V IIX1 X1/CLK input current VIN = 0 V to VCC –10 – +10 µA IILX1 X1/CLK input LOW current – operating VIN = 0 V –75 – 0 µA IIHX1 X1/CLK input HIGH current – operating VIN = VCC 0 – 75 µA IOHX2 X2 output HIGH current – operating VOUT = VCC; X1 = 0 0 – +75 µA IOHX2S X2 output HIGH short circuit current – operating VOUT = 0 V; X1 = 0 –10 – –1 mA IOLX2 X2 output LOW current – operating VOUT = 0 V; X1 = VCC –75 – 0 µA IOLX2S X2 output LOW short circuit current – operating VOUT = VCC; X1 = VCC 1 – 10 mA Input leakage current: II All except input port pins VIN = 0 V to VCC –10 – +10 µA Input port pins VIN = 0 V to VCC –20 – +10 µA IOZH Output off current HIGH, 3-state data bus VIN = VCC – – 10 µA IOZL Output off current LOW, 3-state data bus VIN = 0 V –10 – – µA IODL Open-drain output LOW current in off-state VIN = 0 V –10 – – µA IODH Open-drain output HIGH current in off-state VIN = VCC – – 10 µA ICC Power supply current5 ICC Operating mode CMOS input levels – – 10 mA NOTES: 1. Parameters are valid over specified temperature range. 2. All voltage measurements are referenced to ground (GND). For testing, all inputs swing between 0.4 V and 2.4 V with a transition time of 5 ns maximum. For X1/CLK this swing is between 0.4 V and 4.4 V. All time measurements are referenced at input voltages of 0.8 V and 2.0 V and output voltages of 0.8 V and 2.0 V, as appropriate. 3. Typical values are at +25 °C, typical supply voltages, and typical processing parameters. 4. Test conditions for outputs: CL = 150 pF, except interrupt outputs. Test conditions for interrupt outputs: CL = 50 pF, RL = 2.7 kΩ to VCC. 5. All outputs are disconnected. Inputs are switching between CMOS levels of VCC – 0.2 V and VSS + 0.2 V. |
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