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S0402F Datasheet(PDF) 1 Page - GOOD-ARK Electronics

Part # S0402F
Description  Chip Fuse
PDF  3 Pages
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Manufacturer  GOOD-ARK [GOOD-ARK Electronics]
Direct Link  http://www.goodark.com
Logo GOOD-ARK - GOOD-ARK Electronics

S0402F Datasheet(HTML) 1 Page - GOOD-ARK Electronics

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@copyright Good-Ark2012
www.goodark.com
Chip Fuse
Description
■
Fast acting for excessive current
■
Compatible with reflow and wave solder
■
Rugged ceramic and glass construction
■
Excellent environmental performance
■
RoHS Compliant ,Lead Free & Halogen Free
material
Applications
■
Telecommunication: PDA / DSL/ Cell Phones
■
Computers: LCD Panel / Printers/ Laptop/
Servers
■
Consumer Electronics: DVD player / MP3
MP4 Player
Environmental Data
■
Life Test: 30
°C ±2°C ,75% rated current, 1000 hours,
■
Humidity Bias: MIL-STD-202 , Method 103
■
Moisture Resistance Test: MIL-STD-202, Method 106G
■
Thermal Shock: MIL-STD-202, Method 107G
■
Terminal Strength: AEC-Q200-006
■
Board Flex: AEC-Q200-005 Appendix 2 Note: 1mm (Min)
■
Vibration: MIL-STD-202, Method 204C
■
MechanicalShock:MIL-STD-202,Method 213C
■
Solderability: MIL-STD-202 Method 208H
■
Resistance to Solder Heat: MIL-STD-202,Method 210A
Electrical Characteristics
Ampere Rating
% of Amp Rating
Opening Time
200mA-4A
100%
4 Hours Minimum
200mA-4A
250%
5 Seconds Maximum
Electrical Specifications
Product
Code
Current
Rating
Voltage Rating
Interrupting
Rating*
Resistance
(ohms)**
Typical
Melt I²t ***
DC
DC
Typ.
DC (A²s)
S0402F200
200mA
24V
35A
4.300
0.0008
S0402F250
250mA
24V
35A
3.200
0.0011
S0402F375
375mA
24V
35A
1.140
0.0021
S0402F500
500mA
24V
35A
1.200
0.0043
S0402F Series
Sn PLATING
OVERCOAT
CERAMIC SUBSTRATE
FUSE ELEMENT
Cu / Ni PLATING


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