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K4M513233E-MEC Datasheet(PDF) 5 Page - Samsung semiconductor

Part # K4M513233E-MEC
Description  4M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

K4M513233E-MEC Datasheet(HTML) 5 Page - Samsung semiconductor

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K4M513233E - M(E)C/L/F
February 2004
Mobile-SDRAM
DC CHARACTERISTICS
Recommended operating conditions (Voltage referenced to VSS = 0V, TA = -25 to 70
°C)
NOTES:
1. Measured with outputs open.
2. Refresh period is 64ms.
3. Internal TCSR can be supported(In commercial Temp : Max 40
°C/Max 70°C)
4. K4M513233E-M(E)C**
5. K4M513233E-M(E)L**
6. K4M513233E-M(E)F**
7. Unless otherwise noted, input swing IeveI is CMOS(VIH /VIL=VDDQ/VSSQ).
Parameter
Symbol
Test Condition
Version
Unit
Note
-75
-1H
-1L
Operating Current
(One Bank Active)
ICC1
Burst length = 1
tRC
≥ tRC(min)
IO = 0 mA
170
160
150
mA
1
Precharge Standby Current in
power-down mode
ICC2P
CKE
≤ VIL(max), tCC = 10ns
1.5
mA
ICC2PS
CKE & CLK
≤ VIL(max), tCC = ∞
1.5
Precharge Standby Current
in non power-down mode
ICC2N
CKE
≥ VIH(min), CS ≥ VIH(min), tCC = 10ns
Input signals are changed one time during 20ns
20
mA
ICC2NS
CKE
≥ VIH(min), CLK ≤ VIL(max), tCC = ∞
Input signals are stable
10
Active Standby Current
in power-down mode
ICC3P
CKE
≤ VIL(max), tCC = 10ns
8
mA
ICC3PS
CKE & CLK
≤ VIL(max), tCC = ∞
8
Active Standby Current
in non power-down mode
(One Bank Active)
ICC3N
CKE
≥ VIH(min), CS ≥ VIH(min), tCC = 10ns
Input signals are changed one time during 20ns
45
mA
ICC3NS
CKE
≥ VIH(min), CLK ≤ VIL(max), tCC = ∞
Input signals are stable
40
mA
Operating Current
(Burst Mode)
ICC4
IO = 0 mA
Page burst
4Banks Activated
tCCD = 2CLKs
230
210
210
mA
1
Refresh Current
ICC5
tRC
≥ tRC(min)
350
330
300
mA
2
Self Refresh Current
ICC6
CKE
≤ 0.2V
-C
1800
uA
4
-L
1500
5
-F
Internal TCSR
Max 40
Max 70
°C
3
Full Array
850
1300
uA
6
1/2 of Full Array
600
900
1/4 of Full Array
500
700


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