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K4M513233E-MEC Datasheet(PDF) 5 Page - Samsung semiconductor |
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K4M513233E-MEC Datasheet(HTML) 5 Page - Samsung semiconductor |
5 / 12 page K4M513233E - M(E)C/L/F February 2004 Mobile-SDRAM DC CHARACTERISTICS Recommended operating conditions (Voltage referenced to VSS = 0V, TA = -25 to 70 °C) NOTES: 1. Measured with outputs open. 2. Refresh period is 64ms. 3. Internal TCSR can be supported(In commercial Temp : Max 40 °C/Max 70°C) 4. K4M513233E-M(E)C** 5. K4M513233E-M(E)L** 6. K4M513233E-M(E)F** 7. Unless otherwise noted, input swing IeveI is CMOS(VIH /VIL=VDDQ/VSSQ). Parameter Symbol Test Condition Version Unit Note -75 -1H -1L Operating Current (One Bank Active) ICC1 Burst length = 1 tRC ≥ tRC(min) IO = 0 mA 170 160 150 mA 1 Precharge Standby Current in power-down mode ICC2P CKE ≤ VIL(max), tCC = 10ns 1.5 mA ICC2PS CKE & CLK ≤ VIL(max), tCC = ∞ 1.5 Precharge Standby Current in non power-down mode ICC2N CKE ≥ VIH(min), CS ≥ VIH(min), tCC = 10ns Input signals are changed one time during 20ns 20 mA ICC2NS CKE ≥ VIH(min), CLK ≤ VIL(max), tCC = ∞ Input signals are stable 10 Active Standby Current in power-down mode ICC3P CKE ≤ VIL(max), tCC = 10ns 8 mA ICC3PS CKE & CLK ≤ VIL(max), tCC = ∞ 8 Active Standby Current in non power-down mode (One Bank Active) ICC3N CKE ≥ VIH(min), CS ≥ VIH(min), tCC = 10ns Input signals are changed one time during 20ns 45 mA ICC3NS CKE ≥ VIH(min), CLK ≤ VIL(max), tCC = ∞ Input signals are stable 40 mA Operating Current (Burst Mode) ICC4 IO = 0 mA Page burst 4Banks Activated tCCD = 2CLKs 230 210 210 mA 1 Refresh Current ICC5 tRC ≥ tRC(min) 350 330 300 mA 2 Self Refresh Current ICC6 CKE ≤ 0.2V -C 1800 uA 4 -L 1500 5 -F Internal TCSR Max 40 Max 70 °C 3 Full Array 850 1300 uA 6 1/2 of Full Array 600 900 1/4 of Full Array 500 700 |
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