![]() |
Electronic Components Datasheet Search |
|
TPS61222MDCKTEP Datasheet(PDF) 12 Page - Texas Instruments |
|
|
|
TPS61222MDCKTEP Datasheet(HTML) 12 Page - Texas Instruments |
12 / 20 page ![]() ³ ´ 2 L C 2 TPS61222-EP SLVSBI2 – SEPTEMBER 2012 www.ti.com The following inductor series from different suppliers have been used with TPS61222 converters: Table 2. List of Inductors(1) VENDOR INDUCTOR SERIES EPL3015 Coilcraft EPL2010 Murata LQH3NP Tajo Yuden NR3015 Wurth Elektronik WE-TPC Typ S (1) Design was tested using these components at 25°C ambient temperature. Capacitor Selection Input Capacitor At least a 10- μF input capacitor is recommended to improve transient behavior of the regulator and EMI behavior of the total power supply circuit. A ceramic capacitor placed as close as possible to the VIN and GND pins of the IC is recommended. Output Capacitor For the output capacitor C2 , it is recommended to use small ceramic capacitors placed as close as possible to the VOUT and GND pins of the IC. If, for any reason, the application requires the use of large capacitors which can not be placed close to the IC, the use of a small ceramic capacitor with an capacitance value of around 2.2 μF in parallel to the large one is recommended. This small capacitor should be placed as close as possible to the VOUT and GND pins of the IC. A minimum capacitance value of 4.7 μF should be used, 10 μF are recommended. If the inductor value exceeds 4.7 μH, the value of the output capacitance value needs to be half the inductance value or higher for stability reasons, see Equation 4. (4) The TPS61222 is not sensitive to the ESR in terms of stability. Using low ESR capacitors, such as ceramic capacitors, is recommended anyway to minimize output voltage ripple. If heavy load changes are expected, the output capacitor value should be increased to avoid output voltage drops during fast load transients. Layout Considerations As for all switching power supplies, the layout is an important step in the design, especially at high peak currents and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground paths. The input and output capacitor, as well as the inductor should be placed as close as possible to the IC. The feedback divider should be placed as close as possible to the control ground pin of the IC. To lay out the ground, it is recommended to use short traces as well, separated from the power ground traces. This avoids ground shift problems, which can occur due to superimposition of power ground current and control ground current. Assure that the ground traces are connected close to the device GND pin. THERMAL INFORMATION Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power- dissipation limits of a given component. 12 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links :TPS61222-EP |
Similar Part No. - TPS61222MDCKTEP |
|
Similar Description - TPS61222MDCKTEP |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |