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GS9092A Datasheet(PDF) 59 Page - Semtech Corporation |
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GS9092A Datasheet(HTML) 59 Page - Semtech Corporation |
59 / 61 page GS9092A GenLINX® III 270Mb/s Serializer for SDI and DVB-ASI Final Data Sheet 34715 - 5 February 2013 59 of 61 6.2 Recommended PCB Footprint The Center Pad of the PCB footprint should be connected to the CORE_GND plane by a minimum of 25 vias. Note: Suggested dimensions only. Final dimensions should conform to customer design rules and process optimization. 6.3 Packaging Data NOTE: All dimensions are in millimeters. 7.70 7.70 6.76 6.76 0.50 0.25 0.55 CENTER PAD Parameter Value Package Type 8mm x 8mm 56-pin QFN Package Drawing Reference JEDEC M0220 Moisture Sensitivity Level 3 Junction to Case Thermal Resistance, θj-c 12.2°C/W Junction to Air Thermal Resistance, θj-a (at zero airflow) 25.8°C/W Psi 9.1°C/W Pb-free and RoHS compliant Yes |
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