´

´

´

IN

OUT

IN

OUT

V

(V

- V )

1

L =

f 200 mA

V

TPS61097A-33

www.ti.com

SLVSCF2A – JANUARY 2014 – REVISED DECEMBER 2014

Application Information (continued)

9.1.3 Thermal Considerations

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires

special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added

heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-

dissipation limits of a given component.

Three basic approaches for enhancing thermal performance are listed below.

•

Improving the power dissipation capability of the PCB design

•

Improving the thermal coupling of the component to the PCB

•

Introducing airflow in the system

dissipation is about 191.7 mW. More power can be dissipated if the maximum ambient temperature of the

application is lower.

9.2 Typical Application

Figure 19. Typical Application Schematic

9.2.1 Design Requirements

DESIGN PARAMETERS

EXAMPLE VALUE

1.2 V to 1.8 V

3.3 V

10 mA

9.2.2 Detailed Design Procedure

9.2.2.1 Inductor Selection

To make sure that the TPS61097A-33 devices can operate, a suitable inductor must be connected between pin

VIN and pin L. Inductor values of 4.7

μH show good performance over the whole input and output voltage range .

Choosing other inductance values affects the switching frequency f proportional to 1/L as shown in Equation 1.

(1)

Copyright © 2014, Texas Instruments Incorporated

Submit Documentation Feedback

13