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TLV2372IDG4 Datasheet(PDF) 37 Page - Texas Instruments |
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TLV2372IDG4 Datasheet(HTML) 37 Page - Texas Instruments |
37 / 58 page *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV2370IDBVR SOT-23 DBV 6 3000 182.0 182.0 20.0 TLV2370IDBVT SOT-23 DBV 6 250 182.0 182.0 20.0 TLV2370IDR SOIC D 8 2500 340.5 338.1 20.6 TLV2371IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TLV2371IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TLV2371IDR SOIC D 8 2500 340.5 338.1 20.6 TLV2372IDGKR VSSOP DGK 8 2500 364.0 364.0 27.0 TLV2372IDGKR VSSOP DGK 8 2500 358.0 335.0 35.0 TLV2372IDR SOIC D 8 2500 340.5 338.1 20.6 TLV2373IDGSR VSSOP DGS 10 2500 364.0 364.0 27.0 TLV2373IDGSR VSSOP DGS 10 2500 358.0 335.0 35.0 TLV2373IDR SOIC D 14 2500 333.2 345.9 28.6 TLV2374IDR SOIC D 14 2500 333.2 345.9 28.6 TLV2374IPWR TSSOP PW 14 2000 367.0 367.0 35.0 TLV2375IDR SOIC D 16 2500 333.2 345.9 28.6 TLV2375IPWR TSSOP PW 16 2000 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 7-Jun-2016 Pack Materials-Page 2 |
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