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TLV2372IDG4 Datasheet(PDF) 10 Page - Texas Instruments |
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TLV2372IDG4 Datasheet(HTML) 10 Page - Texas Instruments |
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10 / 58 page  10 TLV2370, TLV2371, TLV2372 TLV2373, TLV2374, TLV2375 SLOS270F – MARCH 2001 – REVISED AUGUST 2016 www.ti.com Product Folder Links: TLV2370 TLV2371 TLV2372 TLV2373 TLV2374 TLV2375 Submit Documentation Feedback Copyright © 2001–2016, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.6 Thermal Information: TLV2373 THERMAL METRIC(1) TLV2373 UNIT DGS (VSSOP) D (SOIC) P (PDIP) 10 PINS 14 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 166.5 67 66.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 41.8 24.1 20.5 °C/W RθJB Junction-to-board thermal resistance 86.1 22.5 26.8 °C/W ψJT Junction-to-top characterization parameter 1.5 2.2 2.1 °C/W ψJB Junction-to-board characterization parameter 84.7 22.1 26.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.7 Thermal Information: TLV2374 THERMAL METRIC(1) TLV2374 UNIT D (SOIC) N (PDIP) PW (TSSOP) 14 PINS 14 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 67 66.3 121 °C/W RθJC(top) Junction-to-case (top) thermal resistance 24.1 20.5 49.4 °C/W RθJB Junction-to-board thermal resistance 22.5 26.8 62.8 °C/W ψJT Junction-to-top characterization parameter 2.2 2.1 5.9 °C/W ψJB Junction-to-board characterization parameter 22.1 26.2 62.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.8 Thermal Information: TLV2375 THERMAL METRIC(1) TLV2375 UNIT D (SOIC) N (PDIP) PW (TSSOP) 16 PINS 16 PINS 16 PINS RθJA Junction-to-ambient thermal resistance 83 55.8 115.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 44 43.1 50.5 °C/W RθJB Junction-to-board thermal resistance 40.5 35.8 60.7 °C/W ψJT Junction-to-top characterization parameter 11.5 27.9 7.4 °C/W ψJB Junction-to-board characterization parameter 40.2 35.7 60.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a °C/W |
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